JPS621297A - プリント回路基板用接着剤組成物 - Google Patents

プリント回路基板用接着剤組成物

Info

Publication number
JPS621297A
JPS621297A JP60140075A JP14007585A JPS621297A JP S621297 A JPS621297 A JP S621297A JP 60140075 A JP60140075 A JP 60140075A JP 14007585 A JP14007585 A JP 14007585A JP S621297 A JPS621297 A JP S621297A
Authority
JP
Japan
Prior art keywords
adhesive composition
component
weight
printed circuit
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60140075A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0473640B2 (enExample
Inventor
薫 金山
吉信 大沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP60140075A priority Critical patent/JPS621297A/ja
Publication of JPS621297A publication Critical patent/JPS621297A/ja
Publication of JPH0473640B2 publication Critical patent/JPH0473640B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP60140075A 1985-06-26 1985-06-26 プリント回路基板用接着剤組成物 Granted JPS621297A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60140075A JPS621297A (ja) 1985-06-26 1985-06-26 プリント回路基板用接着剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60140075A JPS621297A (ja) 1985-06-26 1985-06-26 プリント回路基板用接着剤組成物

Publications (2)

Publication Number Publication Date
JPS621297A true JPS621297A (ja) 1987-01-07
JPH0473640B2 JPH0473640B2 (enExample) 1992-11-24

Family

ID=15260382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60140075A Granted JPS621297A (ja) 1985-06-26 1985-06-26 プリント回路基板用接着剤組成物

Country Status (1)

Country Link
JP (1) JPS621297A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63186787A (ja) * 1987-01-28 1988-08-02 Shin Etsu Chem Co Ltd フレキシブルプリント基板用接着剤組成物
US6359039B1 (en) * 1998-04-28 2002-03-19 Industrial Technology Research Institute Mixing barbituric acid-modified BMI with MEK solution of epoxy resin and elastomer
JP2007051248A (ja) * 2005-08-19 2007-03-01 Kyocera Chemical Corp 導電性接着剤組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63186787A (ja) * 1987-01-28 1988-08-02 Shin Etsu Chem Co Ltd フレキシブルプリント基板用接着剤組成物
US6359039B1 (en) * 1998-04-28 2002-03-19 Industrial Technology Research Institute Mixing barbituric acid-modified BMI with MEK solution of epoxy resin and elastomer
JP2007051248A (ja) * 2005-08-19 2007-03-01 Kyocera Chemical Corp 導電性接着剤組成物

Also Published As

Publication number Publication date
JPH0473640B2 (enExample) 1992-11-24

Similar Documents

Publication Publication Date Title
TWI770037B (zh) 接著劑組成物及其應用的覆蓋膜、撓性覆銅層壓板及黏合片
CN103435812B (zh) 一种苯并噁嗪中间体及其制备方法
US4960860A (en) Imide compound and composition containing the same
US4519941A (en) Metal-filled polyimide/polyepoxide blends of improved electrical conductivity
TW574313B (en) Resin composition for circuit boards
JPS621297A (ja) プリント回路基板用接着剤組成物
JPH0827427A (ja) 耐熱性フィルム接着剤及びその製造方法
JP4087468B2 (ja) 接着剤組成物
JPH04227936A (ja) ポリイミドフィルムの接着方法及び印刷回路基板
JPS58142955A (ja) 接着剤組成物
JP3395845B2 (ja) 積層板用エポキシ樹脂組成物
JP3017562B2 (ja) 配線基板用エポキシ樹脂組成物
JPS6176579A (ja) 耐燃性接着剤組成物
JPS6121132A (ja) ソルダ−レジスト用樹脂組成物
JPH09132635A (ja) ハロゲン含量の低いビスフェノールｆ型エポキシ樹脂、その製造法、エポキシ樹脂組成物及び硬化物
TW466265B (en) High-performance adhesive compositions
JPH0275676A (ja) 熱硬化性エポキシ樹脂ワニス
JPS6361351B2 (enExample)
JPH0321587B2 (enExample)
JP3439262B2 (ja) 高温時の物性が改良されたフィルム接着剤及びその製造方法
JPH0359947B2 (enExample)
JPH0834968A (ja) 低温加工性の優れた耐熱性フィルム接着剤及びその製造方法
CN101210077B (zh) 无卤耐高温组合物
JPH0834969A (ja) 低温加工性の優れた耐熱性フィルム接着剤及びその製造方法
JPH0827430A (ja) 高温時の物性が改良されたフィルム接着剤及びその製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term