JPS62128156A - Integrated circuit parts - Google Patents

Abstract

PURPOSE:To make a high by integrated packaging possible by a method wherein a noise removing capacitor part, consisting of a high dielectric constant body and an electrode and having the function as a capacitor, is provided in a package. CONSTITUTION:A noise removing capacitor part 16 is composed of electrodes 15A and 15B and a high dielectric constant body 14, the capacitor part 16 performs the function equal to that of an ordinary capacitor, and it is formed in laminated shape. The noise removing capacitor part 16 formed in a package 10 is connected to the power source 12A and the grounding terminal 12G of the IC of an internal IC ship 11. As a result,the noise generated both outside and the inside of the IC parts 1 is absorbed and removed by the capacitor of the noise removing capacitor part 16 located inside the package 10 even when the IC parts 1 are mounted on a printed substrate without external attachment of a bypass capacitor.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an IC component incorporating an IC chip on which an integrated circuit (hereinafter referred to as IC) is formed.

[Conventional technology]

FIG. 2 is a diagram showing a conventional method for removing external noise to an IC component incorporating an IC chip formed therein or noise generated in the IC component. 2 is a power supply and a power line of a printed circuit board connected to the power input side of IC component 1;
4 is a ground line that is also grounded and connected to the ground side of the IC component 1, and 4 is a bypass capacitor for noise removal that is connected between the power supply line 2 and the ground line 3.

Next, the operation will be explained. Noise transmitted through the power supply line 2 will enter the IC in the IC component 1 and cause malfunction, and in the worst case, it will destroy the IC in the IC component 1. The noise is absorbed by a bypass capacitor 4 to prevent the noise from entering the IC in the IC component 1.

On the other hand, when the IC component 1 is a digital IC, the noise generated in the IC component 1 when the transistor performs the switching operation inside the IC component 1 is emitted to the outside and causes other noise. In order to prevent an adverse effect on the IC (not shown), this noise is absorbed by a bypass capacitor 4.

[Problem that the invention seeks to solve]

Conventional IC parts are configured as described above, so I
When mounting C components on a printed circuit board, it is necessary to mount a bypass capacitor on the printed circuit board to eliminate noise, which requires space for mounting the capacitor in addition to the IC components, prevents high-density mounting, and reduces the number of components. There were problems such as an increase in

This invention was made to solve the above-mentioned problems, and by providing a function as a bypass capacitor within the IC package, it eliminates the need for an external capacitor and reduces the number of components. The objective is to obtain IC components that enable high-density packaging and have excellent noise resistance.

[Means for solving problems]

The IC component according to the present invention is an IC chip in which a noise-eliminating capacitor section consisting of a high dielectric constant material and an electrode and having a function of a capacitor is provided in a package, and the electrode of this capacitor section is built into the package. It is designed to be connected to the power supply connection side and the ground side of the IC.

[For production]

The noise removal capacitor section in the present invention functions as a so-called bypass capacitor that absorbs noise from the outside of the IC component and noise generated by the IC inside the IC component.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a cross section of an IC component according to an embodiment of the present invention.

In the figure, 10 is a box-shaped package made of an insulator such as plastic, 11 is an IC chip provided at the bottom of the inside of the package 10, and 12 is a conductive material that protrudes from the bottom of the package 10 downward to the outside in the same direction. A large number of IC pins, 12S is an IC for power supply connection among the IC pins 12.
Pin 12G is a grounding IC pin among the IC pins 12. 13 is the IC of IC chip 11 and IC pin 12
The lead wire 13S connects the lead wire 13
13G is one of the lead wires 13 that connects the IC pin 12G and the IC chip 1.
This is a lead wire that connects the ground connection side of IC No. 1. 14 is a high dielectric constant body made of a dielectric material having a high dielectric constant, which is fixed on the upper half side inside the package 1°;
A and 15B are a pair of comb-shaped electrodes provided inside the high dielectric constant material 14 so that the electrodes are arranged alternately.

One end of the electrode 15A is connected to the IC pin 12G within the package 10, and one end of the electrode 15B is connected to the IC pin 12S within the package 10. 16 is a capacitor section for noise removal, electrodes 15A, 15B and high dielectric constant material 1
4 and has the same function as a normal capacitor, and in this embodiment, it is in the form of a multilayer capacitor. Note that the support structure for the IC chip 11 within the package 10 is omitted because it is well known.

As described above, since the noise removal capacitor section 16 formed inside the package 10 is connected to the IC power supply and ground terminal of the internal IC chip 11, the IC component 1 can be mounted on a printed circuit board without externally attaching a bypass capacitor. Even when mounted, noise from the outside of the IC component 1 and noise generated inside the IC component 1 are absorbed and removed by the capacitance of the noise removing capacitor 16 inside the package 10.

FIG. 2 is a sectional view of an IC component showing another embodiment of the present invention. In the figure, 17 is a package made of, for example, a ceramic material with a high dielectric constant, and also serves as the above-mentioned high dielectric constant material of the noise removal capacitor section 16.

For example, when a ceramic material with a high dielectric constant is used as the package 17, if the electrodes 15A and 15B for the capacitor part 16 are formed inside the package 17 during the molding process and are made to face each other, it is possible to create a high dielectric between the two electrodes 15A and 15B. Since a ceramic material of a certain ratio is disposed, a ceramic capacitor is formed as the noise removing capacitor section 16.

It goes without saying that the noise removal capacitor section 16 may take the form of any type of capacitor as long as it has the function of a capacitor.

In each of the above-described embodiments, it goes without saying that arranging the noise-eliminating capacitor section 16 directly above the IC chip 11 leads to an improvement in the packaging density.

Further, in each of the above embodiments, a box-shaped package is used, but any shape may be used, and a package formed by molding a noise removal capacitor section or an IC chip may also be used.

Furthermore, in each of the above embodiments, if the connection parts between the lead wires and electrodes and the IC pins are buried in the package, those connection parts are strengthened.

In the above embodiment, a capacitor was formed inside the package, but it is also possible to form a resistor or the like! D. External attachment of IC parts can reduce the number of parts.

〔Effect of the invention〕

) As described above, according to the present invention, a capacitor portion having the function of a capacitor is formed inside the package and is connected to the IC of the IC chip inside the package to remove noise. There is no need to externally attach a capacitor, the number of parts is reduced and high-density mounting is possible, and the noise resistance of the IC is improved.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an IC component according to an embodiment of the present invention;
FIG. 2 is a sectional view of an IC component according to another embodiment, and FIG. 3 is a diagram showing a conventional IC component mounted on a printed circuit board. In the figure, 1 is an IC component, 2 is a power line, 3 is a ground line, 10 is a package, 11 is an IC chip, 1
2 is an IC pin, 12S is a power supply pin, 12G is a grounding pin, 13 is a lead wire, 14 is a high dielectric constant material, 15 is an electrode, 16 is a capacitor section for noise removal, and 17 is a package. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (3)

[Claims] (1) An integrated circuit chip having an integrated circuit is housed in a package made of an insulating material, and pins connected to the integrated circuit are exposed to the outside of the package for mounting on a printed circuit board. In the integrated circuit component having a power supply pin for connecting the integrated circuit to a power supply and a grounding pin for grounding the integrated circuit, the package includes a high dielectric constant material made of a dielectric material having a high dielectric constant, and a high dielectric constant material made of a dielectric material having a high dielectric constant, and a high dielectric constant material made of a dielectric material having a high dielectric constant, A noise removal capacitor section is provided, which is composed of a pair of electrodes facing each other with a dielectric material of a dielectric constant in between, and has the function of a capacitor, one of the electrodes is connected to the power supply pin, and the other of the electrodes is connected to the power supply pin. An integrated circuit component characterized by being connected to a grounding pin. (2) The integrated circuit component according to claim 1, wherein the package also serves as the high dielectric constant material. (3) The integrated circuit component according to claim 2, wherein the material of the package is made of ceramic having a high dielectric constant.