JPH01191461A - Ic package - Google Patents

Ic package

Info

Publication number
JPH01191461A
JPH01191461A JP63014741A JP1474188A JPH01191461A JP H01191461 A JPH01191461 A JP H01191461A JP 63014741 A JP63014741 A JP 63014741A JP 1474188 A JP1474188 A JP 1474188A JP H01191461 A JPH01191461 A JP H01191461A
Authority
JP
Japan
Prior art keywords
capacitor
ic element
power source
ic
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63014741A
Inventor
Tomoyuki Kaneko
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP63014741A priority Critical patent/JPH01191461A/en
Publication of JPH01191461A publication Critical patent/JPH01191461A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PURPOSE: To omit connection to an external capacitor, to remove high frequency noises and to implement high density mounting, by incorporating a bypass capacitor as a unitary body in an IC package, and connecting the capacitor between the power source pins of an IC element.
CONSTITUTION: An insulating film 7 comprising dielectric material is provided between metal films 6a and 6b which are connected to power source pins 5a and 5b. A parallel-plate capacitor is formed and made to be a bypass capacitor 8. The capacitor can be incorporated as a unitary body in a space 1a of a package 1. Connection can be performed at the closest position to an IC element 2. Frequency noises generated in the IC element 2 can be effectively removed.
COPYRIGHT: (C)1989,JPO&Japio
JP63014741A 1988-01-27 1988-01-27 Ic package Pending JPH01191461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63014741A JPH01191461A (en) 1988-01-27 1988-01-27 Ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63014741A JPH01191461A (en) 1988-01-27 1988-01-27 Ic package

Publications (1)

Publication Number Publication Date
JPH01191461A true JPH01191461A (en) 1989-08-01

Family

ID=11869544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63014741A Pending JPH01191461A (en) 1988-01-27 1988-01-27 Ic package

Country Status (1)

Country Link
JP (1) JPH01191461A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5475264A (en) * 1992-07-30 1995-12-12 Kabushiki Kaisha Toshiba Arrangement having multilevel wiring structure used for electronic component module
US5523622A (en) * 1992-11-24 1996-06-04 Hitachi, Ltd. Semiconductor integrated device having parallel signal lines

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5475264A (en) * 1992-07-30 1995-12-12 Kabushiki Kaisha Toshiba Arrangement having multilevel wiring structure used for electronic component module
US5523622A (en) * 1992-11-24 1996-06-04 Hitachi, Ltd. Semiconductor integrated device having parallel signal lines

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