JPS62127437A - 半導体素子用ボンデイング線 - Google Patents

半導体素子用ボンデイング線

Info

Publication number
JPS62127437A
JPS62127437A JP60265620A JP26562085A JPS62127437A JP S62127437 A JPS62127437 A JP S62127437A JP 60265620 A JP60265620 A JP 60265620A JP 26562085 A JP26562085 A JP 26562085A JP S62127437 A JPS62127437 A JP S62127437A
Authority
JP
Japan
Prior art keywords
wire
bonding
gold
copper
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60265620A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222130B2 (de
Inventor
Takatoki Fukuda
福田　孝祝
Eiichi Fujimoto
栄一 藤本
Toshitake Otaki
大滝　俊武
Harumichi Okamoto
岡本　晴道
Takashi Ogata
緒方　俊
Norimichi Matsusue
松末　則道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd, Tatsuta Electric Wire and Cable Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP60265620A priority Critical patent/JPS62127437A/ja
Publication of JPS62127437A publication Critical patent/JPS62127437A/ja
Publication of JPH0222130B2 publication Critical patent/JPH0222130B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01022—Titanium [Ti]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01205—5N purity grades, i.e. 99.999%

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60265620A 1985-11-26 1985-11-26 半導体素子用ボンデイング線 Granted JPS62127437A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60265620A JPS62127437A (ja) 1985-11-26 1985-11-26 半導体素子用ボンデイング線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60265620A JPS62127437A (ja) 1985-11-26 1985-11-26 半導体素子用ボンデイング線

Publications (2)

Publication Number Publication Date
JPS62127437A true JPS62127437A (ja) 1987-06-09
JPH0222130B2 JPH0222130B2 (de) 1990-05-17

Family

ID=17419663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60265620A Granted JPS62127437A (ja) 1985-11-26 1985-11-26 半導体素子用ボンデイング線

Country Status (1)

Country Link
JP (1) JPS62127437A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6365035A (ja) * 1986-09-05 1988-03-23 Furukawa Electric Co Ltd:The 銅細線とその製造方法
JPH02232327A (ja) * 1989-03-06 1990-09-14 Nippon Mining Co Ltd 加工性，耐熱性の優れた高導電性銅合金

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049706A (ja) * 1983-08-30 1985-03-19 ヤンマー農機株式会社 収穫機の刈高さ自動調節装置
JPS60194032A (ja) * 1984-03-15 1985-10-02 Sumitomo Metal Mining Co Ltd 軟化温度の低い高導電用銅材
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61221335A (ja) * 1985-03-27 1986-10-01 Mitsubishi Metal Corp 極軟質銅材の製造法
JPS61259558A (ja) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS62102551A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049706A (ja) * 1983-08-30 1985-03-19 ヤンマー農機株式会社 収穫機の刈高さ自動調節装置
JPS60194032A (ja) * 1984-03-15 1985-10-02 Sumitomo Metal Mining Co Ltd 軟化温度の低い高導電用銅材
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61221335A (ja) * 1985-03-27 1986-10-01 Mitsubishi Metal Corp 極軟質銅材の製造法
JPS61259558A (ja) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS62102551A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6365035A (ja) * 1986-09-05 1988-03-23 Furukawa Electric Co Ltd:The 銅細線とその製造方法
JPH02232327A (ja) * 1989-03-06 1990-09-14 Nippon Mining Co Ltd 加工性，耐熱性の優れた高導電性銅合金

Also Published As

Publication number Publication date
JPH0222130B2 (de) 1990-05-17

Similar Documents

Publication Publication Date Title
EP0922780B1 (de) Verfahren zur Herstellung von einer hochreinen Hartgoldlegierung
JPS62127438A (ja) 半導体素子用ボンディング線
JPS62228440A (ja) 半導体素子ボンデイング用金線
JP2873770B2 (ja) 半導体素子のワイヤボンディング用パラジウム細線
JPS62278241A (ja) ボンデイングワイヤ
JP2911886B2 (ja) セリウムミッシュメタルを含有する金合金から成る極細線及びその製造方法
JPH0713273B2 (ja) 半導体素子用ボンディング線およびその製造方法
JPS63235440A (ja) 銅細線及びその製造方法
JPS63211731A (ja) ボンデイング線
JPS62127437A (ja) 半導体素子用ボンデイング線
JPS62127436A (ja) 半導体素子用ボンディング線
JP3090549B2 (ja) 半導体素子用ボンディング線
JPS63235442A (ja) 銅細線及びその製造方法
JPH0464121B2 (de)
JPH06112258A (ja) 半導体素子用ボンディング線
JPH084099B2 (ja) 耐食性に優れた半導体素子用銅ボンディング線
JPS63118033A (ja) ボンデイングワイヤ−及びその製造方法
JPS63241942A (ja) 銅細線及びその製造方法
JPS61110735A (ja) 耐熱性に優れた金合金
JPH0131691B2 (de)
JP2706539B2 (ja) ボンディングワイヤー
JPS63247325A (ja) 銅細線及びその製造方法
JPS633424A (ja) 配線性に優れた半導体素子用銅ボンディング線の製造方法
JPS63227733A (ja) 耐熱性に優れた金合金
JPH0131692B2 (de)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees