JPS62127436A - 半導体素子用ボンディング線 - Google Patents

半導体素子用ボンディング線

Info

Publication number
JPS62127436A
JPS62127436A JP60265619A JP26561985A JPS62127436A JP S62127436 A JPS62127436 A JP S62127436A JP 60265619 A JP60265619 A JP 60265619A JP 26561985 A JP26561985 A JP 26561985A JP S62127436 A JPS62127436 A JP S62127436A
Authority
JP
Japan
Prior art keywords
wire
bonding
gold
ball
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60265619A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0379415B2 (enExample
Inventor
Harumichi Okamoto
岡本　晴道
Takashi Ogata
緒方　俊
Norimichi Matsusue
松末　則道
Takatoki Fukuda
福田　孝祝
Eiichi Fujimoto
栄一 藤本
Toshitake Otaki
大滝　俊武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd, Tatsuta Electric Wire and Cable Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP60265619A priority Critical patent/JPS62127436A/ja
Publication of JPS62127436A publication Critical patent/JPS62127436A/ja
Publication of JPH0379415B2 publication Critical patent/JPH0379415B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Wire Bonding (AREA)
JP60265619A 1985-11-26 1985-11-26 半導体素子用ボンディング線 Granted JPS62127436A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60265619A JPS62127436A (ja) 1985-11-26 1985-11-26 半導体素子用ボンディング線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60265619A JPS62127436A (ja) 1985-11-26 1985-11-26 半導体素子用ボンディング線

Publications (2)

Publication Number Publication Date
JPS62127436A true JPS62127436A (ja) 1987-06-09
JPH0379415B2 JPH0379415B2 (enExample) 1991-12-18

Family

ID=17419649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60265619A Granted JPS62127436A (ja) 1985-11-26 1985-11-26 半導体素子用ボンディング線

Country Status (1)

Country Link
JP (1) JPS62127436A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310931A (ja) * 1987-06-10 1988-12-19 Furukawa Electric Co Ltd:The フレキシブルプリント用銅合金
JPH02232327A (ja) * 1989-03-06 1990-09-14 Nippon Mining Co Ltd 加工性，耐熱性の優れた高導電性銅合金
WO2006134724A1 (ja) 2005-06-15 2006-12-21 Nippon Mining & Metals Co., Ltd. 超高純度銅及びその製造方法並びに超高純度銅からなるボンディングワイヤ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310931A (ja) * 1987-06-10 1988-12-19 Furukawa Electric Co Ltd:The フレキシブルプリント用銅合金
JPH02232327A (ja) * 1989-03-06 1990-09-14 Nippon Mining Co Ltd 加工性，耐熱性の優れた高導電性銅合金
WO2006134724A1 (ja) 2005-06-15 2006-12-21 Nippon Mining & Metals Co., Ltd. 超高純度銅及びその製造方法並びに超高純度銅からなるボンディングワイヤ
EP2845915A1 (en) 2005-06-15 2015-03-11 JX Nippon Mining & Metals Corporation Ultrahigh-purity copper bonding wire

Also Published As

Publication number Publication date
JPH0379415B2 (enExample) 1991-12-18

Similar Documents

Publication Publication Date Title
JPS6238414B2 (enExample)
EP0922780B1 (en) Method of manufacturing a high purity hard gold alloy
JP3382918B2 (ja) 半導体素子接続用金線
JPS62127438A (ja) 半導体素子用ボンディング線
JPS62228440A (ja) 半導体素子ボンデイング用金線
JP2873770B2 (ja) 半導体素子のワイヤボンディング用パラジウム細線
JPH0713273B2 (ja) 半導体素子用ボンディング線およびその製造方法
JPS62127436A (ja) 半導体素子用ボンディング線
JPS63211731A (ja) ボンデイング線
JPS63235440A (ja) 銅細線及びその製造方法
JPS60162741A (ja) ボンデイングワイヤ−
JPS62127437A (ja) 半導体素子用ボンデイング線
CN101601126B (zh) 用于球焊的金合金线
JPH0245336B2 (enExample)
JP3811600B2 (ja) 半導体素子金合金線
JPH06112258A (ja) 半導体素子用ボンディング線
JPS62216238A (ja) 耐食性に優れた半導体素子用銅ボンデイング線
JPS5826662B2 (ja) 半導体素子のボンデイング用金線
JPH0131691B2 (enExample)
JPH0719787B2 (ja) ボンディング用金合金細線
JPH06112255A (ja) 半導体素子用ボンディング線
JP2706539B2 (ja) ボンディングワイヤー
JPH0131692B2 (enExample)
JPS63241942A (ja) 銅細線及びその製造方法
JPH02205641A (ja) ボンディング用金合金細線

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees