JPS62124115A - One-pack type epoxy resin sealing compound - Google Patents

Abstract

PURPOSE:The titled quick-curing sealing compound, containing 2,4-dihydrazino-6- methylamino-s-triazine (hereinafter abbreviated to 2,4-HT) as a curing agent and a straight-chain saturated dicarboxylic acid as a curing accelerator and a filler and having a long pot life. CONSTITUTION:A sealing compound obtained by incorporating 2,4-dihydrazino-6- methylamino-s-triazine (2,4-HT) expressed by the formula as a curing agent in an amount of preferably 9-23 PHR and a straight-chain saturated dicarboxylic acid, e.g. sebacic acid, succinic acid or adipic acid, etc., as a curing accelerator in an amount of preferably 0.1-10 PHR as active ingredients in an epoxy resin.

Description

[Detailed description of the invention] [Technical field] This invention belongs to the field of epoxy resin manufacturing technology.

More specifically, it belongs to the technical field of one-component sealants for electronic components using epoxy resins.

[Background Art] Traditionally, a significant problem in producing one-component epoxy resin encapsulants has been the lack of suitable curing agents. In other words, most curing agents have a short pot life and are not suitable as one-component sealants, or conversely, their curing temperatures are high and their practicality (especially as a sealant) is poor. There was a drawback. It was thought that this problem could be overcome by discovering a suitable curing agent.

For example, 2,4-dihydrazino-6-methylamino-s-)riazine (2,4-d
ihydrazyno-6-methylamino-s
It is already known that -triazine (hereinafter abbreviated as 2°411T) H3 can be used as a curing agent for epoxy resins. 2.4) Because IT has a heat-resistant skeleton (triazine ring), it is characterized by the ability to obtain cured products with good heat resistance, and it is also known that it can be used as a one-component curing agent. . However, the above 2,4HT
When applied to screw-type epoxy resins, the curing temperature must be increased, requiring high-temperature and long-time curing conditions of 24 hours or more at 160°C. As described above, those that can be used as one-component curing agents have strict curing conditions, and those that cannot be used have a short pot life and are not practical.

On the other hand, when 2,4 HT is used as a curing agent in a one-component sealant for drip coating electronic components, especially ICs,
The present inventors have already found that the performance is improved when subjected to the THB test. However, in this case as well, the pot life is short as mentioned above, or the curing process requires high temperatures.
The drawback is that it takes a long time, and improvements in this point have been desired.

[Object of the invention] This invention uses 2,4 HT as a curing agent in producing a one-component epoxy resin sealant, and accelerates curing without shortening the pot life. Furthermore, it is an object of the present invention to provide a sealant with excellent THB performance.

[Disclosure of the Invention] The present invention provides a one-component epoxy resin composition in which 2,4-dihydrazino-6-methylamino-S-triazine, a linear saturated dicarboxylic acid, and a filler are blended as active ingredients in an epoxy resin. The present invention provides an epoxy resin-liquid sealant characterized by the following.

More specifically, 9 to 23 PHR of 2,4 HT and 0.1 to 10 PHR of one or more linear saturated dicarboxylic acids having 4 to 10 carbon atoms are added to the epoxy resin.
(all values are converted into an epoxy resin with an epoxy equivalent of 184), fillers, and other additives that are blended as necessary as sealants (for example, diluents, coupling agents,
A one-component epoxy resin composition is obtained by dispersing a defoaming agent, etc.) by an appropriate method.

Note that it is desirable to perform vacuum degassing during mixing in order to remove air bubbles from the sealant.

The above linear saturated dicarboxylic acid is thought to act as a curing accelerator when 2.41 (T) is used as a curing agent.The mechanism by which the linear saturated dicarboxylic acid acts to accelerate curing is not clear. Although not understood, it is believed that when the dicarboxylic acid is heated, it dissolves in the epoxy resin and then has some effect on 2.41(T).

If the amount of directly saturated dicarboxylic acid is less than 0.1, the effect of accelerating curing will not be sufficient, and if it is more than 10P), plasticization will occur and the glass transition temperature (Tg) required as a sealant will decrease. This is not preferable because it lowers the heat resistance and sharply lowers the heat resistance. As understood from the examples and comparative examples in Table 1,
Straight chain saturated dicarboxylic acid alone has no curing ability;
It only accelerates the curing of 2,4 IT when used in combination with 2,4 HT.

If the amount of 2.4HT used is less than 9 P) IR, curing will be extremely slow and the reliability of the sealed product will decrease.

Also, if it exceeds 23P PIIR, the surplus 2.4
HT is undesirable because it increases hygroscopicity and also reduces reliability.

The type of epoxy resin used in this invention is not particularly limited, but it is particularly effective in the case of Ebisu type epoxy resin.

Example Using an epoxy resin, 2,4 HT and the linear saturated dicarboxylic acid listed in Table 1 were blended therein in the amounts listed in the same table, and the mixture was dispersed for 24 hours using a bookwormer.
Furthermore, 50% by weight of filler was added, and 3
A sealant was obtained by mixing and smoking for 0 minutes.

Using the above sealant, an element with a horizontal aluminum pattern (line spacing 5 μm, line width 5 μm, circuit thickness 1 μm
) was sealed and cured under predetermined conditions, and then subjected to a THB test. Table 1 shows the results.

The epoxy resin used was ELA127 (trademark, Sumitomo Chemical ■), 2.4117 was manufactured by Nippon Hydrazine ■, and the linear saturated dicarboxylic acid was manufactured by Hanui Chemical.

[Effects of the Invention] This invention provides a one-component epoxy resin composition in which 2,4-dihydrazino-6-methylamino-s-triazine, a linear saturated dicarboxylic acid, and a filler are blended as active ingredients in the epoxy resin. Because of these characteristics, it is possible to provide a one-component epoxy resin sealant that has a long pot life, fast curing properties, and high sealing reliability.

Claims (2)

[Claims] (1) In a one-component epoxy resin sealant, 2,4-dihydrazino-6-methylamino-s is added to the epoxy resin.
- A one-component epoxy resin sealant characterized by containing triazine, a linear saturated dicarboxylic acid, and a filler as active ingredients. (2) 2,4-dihydrazino-6-methylamino- based on an epoxy resin with an epoxy equivalent of 184
The amount of s-triazine is between 9 and 23 with respect to the epoxy resin.
2. The one-component epoxy resin sealant according to claim 1, wherein the amount of linear saturated dicarboxylic acid is in the range of 0.1 to 10 PHR based on the epoxy resin.