JPS62118507A - 電子部品素子へのリ−ド線の半田付け方法 - Google Patents
電子部品素子へのリ−ド線の半田付け方法Info
- Publication number
- JPS62118507A JPS62118507A JP60258894A JP25889485A JPS62118507A JP S62118507 A JPS62118507 A JP S62118507A JP 60258894 A JP60258894 A JP 60258894A JP 25889485 A JP25889485 A JP 25889485A JP S62118507 A JPS62118507 A JP S62118507A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- solder
- component element
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 14
- 238000005476 soldering Methods 0.000 title claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 230000004907 flux Effects 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60258894A JPS62118507A (ja) | 1985-11-18 | 1985-11-18 | 電子部品素子へのリ−ド線の半田付け方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60258894A JPS62118507A (ja) | 1985-11-18 | 1985-11-18 | 電子部品素子へのリ−ド線の半田付け方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118507A true JPS62118507A (ja) | 1987-05-29 |
| JPH0365006B2 JPH0365006B2 (enExample) | 1991-10-09 |
Family
ID=17326502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60258894A Granted JPS62118507A (ja) | 1985-11-18 | 1985-11-18 | 電子部品素子へのリ−ド線の半田付け方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118507A (enExample) |
-
1985
- 1985-11-18 JP JP60258894A patent/JPS62118507A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0365006B2 (enExample) | 1991-10-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |