JPS62118478U - - Google Patents
Info
- Publication number
- JPS62118478U JPS62118478U JP475686U JP475686U JPS62118478U JP S62118478 U JPS62118478 U JP S62118478U JP 475686 U JP475686 U JP 475686U JP 475686 U JP475686 U JP 475686U JP S62118478 U JPS62118478 U JP S62118478U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- chip components
- foil substrate
- silk screen
- screen printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案の第一の実施例を示すチツプ
部品搭載用銅箔基板の要部の平面図、第２図は、
同第一の実施例を示すチツプ部品実装時のチツプ
部品搭載用銅箔基板の平面図、第３図は、同第一
の実施例を示すチツプ部品実装時のチツプ部品搭
載用銅箔基板の断面図、第４図は、本考案の第２
の実施例を示すチツプ部品搭載用銅箔基板の要部
の平面図、第５図は、本考案の同第２の実施例を
示すチツプ部品実装時のチツプ部品搭載用銅箔基
板の断面図、第６図は、本考案の第３の実施例を
示すチツプ部品搭載用銅箔基板の平面図、第７図
は、従来のチツプ部品搭載用銅箔基板の平面図、
第８図は、従来のチツプ部品搭載用銅箔基板の断
面図、第９図及び第１０図は、従来の接着剤塗布
時のチツプ部品搭載用銅箔基板の平面図、第１１
図は、従来のチツプ部品実装時のチツプ部品搭載
用銅箔基板の平面図、第１２及び第１３図は、従
来のチツプ部品実装時のチツプ部品搭載用銅箔基
板の断面図である。
１…ランド、３，８，９，１１…シルクスクリ
ーン印刷、４…接着剤、５…チツプ部品。
FIG. 1 is a plan view of the main parts of a copper foil board for mounting chip components, showing the first embodiment of the present invention, and FIG.
FIG. 3 is a plan view of a copper foil board for mounting chip components when mounting chip components, showing the first embodiment. FIG. The sectional view, FIG.
FIG. 5 is a plan view of the main parts of a copper foil substrate for mounting chip components showing the second embodiment of the present invention, and FIG. , FIG. 6 is a plan view of a copper foil substrate for mounting chip components showing a third embodiment of the present invention, and FIG. 7 is a plan view of a conventional copper foil substrate for mounting chip components.
FIG. 8 is a cross-sectional view of a conventional copper foil substrate for mounting chip components, FIGS. 9 and 10 are plan views of a copper foil substrate for mounting chip components when conventional adhesive is applied, and FIG.
The figure is a plan view of a copper foil substrate for mounting chip components during conventional chip component mounting, and FIGS. 12 and 13 are cross-sectional views of the copper foil substrate for mounting chip components during conventional chip component mounting. 1... Land, 3, 8, 9, 11... Silk screen printing, 4... Adhesive, 5... Chip parts.
Claims (1)
塗布部分を切れ目なく囲んでいるシルクスクリー
ン印刷部分より構成された前記接着剤の塗布案内
部を有することを特徴とするチツプ部品搭載用銅
箔基板。 (2) 上記シルクスクリーン印刷部分が長円形状
であることを特徴とする実用新案登録請求の範囲
第(1)項記載のチツプ部品搭載用銅箔基板。 (3) 上記シルクスクリーン印刷部分が長方形状
であることを特徴とする実用新案登録請求の範囲
第(1)項記載のチツプ部品搭載用銅箔基板。[Claims for Utility Model Registration] (1) An adhesive application guide section consisting of an adhesive application area for temporary fixing of chip parts and a silk screen printed area that seamlessly surrounds the application area. Copper foil substrate for mounting chip components. (2) The copper foil substrate for mounting chip components according to claim (1) of the utility model registration, characterized in that the silk screen printed portion has an oval shape. (3) The copper foil substrate for mounting chip components according to claim (1), wherein the silk screen printed portion is rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP475686U JPS62118478U (en) | 1986-01-17 | 1986-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP475686U JPS62118478U (en) | 1986-01-17 | 1986-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118478U true JPS62118478U (en) | 1987-07-28 |
Family
ID=30785710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP475686U Pending JPS62118478U (en) | 1986-01-17 | 1986-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118478U (en) |
-
1986
- 1986-01-17 JP JP475686U patent/JPS62118478U/ja active Pending
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