JPH02106872U - - Google Patents
Info
- Publication number
- JPH02106872U JPH02106872U JP1517289U JP1517289U JPH02106872U JP H02106872 U JPH02106872 U JP H02106872U JP 1517289 U JP1517289 U JP 1517289U JP 1517289 U JP1517289 U JP 1517289U JP H02106872 U JPH02106872 U JP H02106872U
- Authority
- JP
- Japan
- Prior art keywords
- lands
- circuit board
- mounting
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Description
第１図は、本考案の回路基板の実施例を示す要
部の断面図。第２図は、従来の回路基板を示す要
部の断面図。第３図、第４図および第５図は本考
案の回路基板の他の実施例を示す要部の断面図。
１……回路基板、２……素子搭載用ランド、３
……レジスト、４……シルク、５……樹脂。
FIG. 1 is a sectional view of essential parts showing an embodiment of the circuit board of the present invention. FIG. 2 is a sectional view of the main parts of a conventional circuit board. 3, 4, and 5 are sectional views of main parts showing other embodiments of the circuit board of the present invention. 1... Circuit board, 2... Element mounting land, 3
...Resist, 4...Silk, 5...Resin.
Claims (1)
る回路基板において、前記素子搭載用ランド間に
ハンダ流れ止めを設けたことを特徴とする回路基
板。 1. A circuit board having lands for mounting surface mounting elements, characterized in that a solder flow stopper is provided between the element mounting lands.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1517289U JPH02106872U (en) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1517289U JPH02106872U (en) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106872U true JPH02106872U (en) | 1990-08-24 |
Family
ID=31226996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1517289U Pending JPH02106872U (en) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106872U (en) |
-
1989
- 1989-02-10 JP JP1517289U patent/JPH02106872U/ja active Pending