JPS6211789B2 - - Google Patents
Info
- Publication number
- JPS6211789B2 JPS6211789B2 JP55156723A JP15672380A JPS6211789B2 JP S6211789 B2 JPS6211789 B2 JP S6211789B2 JP 55156723 A JP55156723 A JP 55156723A JP 15672380 A JP15672380 A JP 15672380A JP S6211789 B2 JPS6211789 B2 JP S6211789B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- well
- oxidation
- oxide film
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 52
- 230000003647 oxidation Effects 0.000 claims description 44
- 238000007254 oxidation reaction Methods 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 30
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 20
- 238000002955 isolation Methods 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 18
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 14
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000000295 complement effect Effects 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 claims description 2
- 229910021344 molybdenum silicide Inorganic materials 0.000 claims description 2
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 claims description 2
- 229910021342 tungsten silicide Inorganic materials 0.000 claims description 2
- 230000007547 defect Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 238000000992 sputter etching Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- -1 boron ions Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 241000293849 Cordylanthus Species 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55156723A JPS5780757A (en) | 1980-11-07 | 1980-11-07 | Manufacture of complementary mos semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55156723A JPS5780757A (en) | 1980-11-07 | 1980-11-07 | Manufacture of complementary mos semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5780757A JPS5780757A (en) | 1982-05-20 |
JPS6211789B2 true JPS6211789B2 (ko) | 1987-03-14 |
Family
ID=15633918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55156723A Granted JPS5780757A (en) | 1980-11-07 | 1980-11-07 | Manufacture of complementary mos semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5780757A (ko) |
-
1980
- 1980-11-07 JP JP55156723A patent/JPS5780757A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5780757A (en) | 1982-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2982383B2 (ja) | Cmosトランジスタの製造方法 | |
JPS59138379A (ja) | 半導体装置の製造方法 | |
KR950010287B1 (ko) | 베이스 재결합 전류가 낮은 바이폴라 트랜지스터를 갖는 바이폴라 상보형 금속 산화물 반도체 제조 방법 | |
JPS62290173A (ja) | 半導体集積回路装置の製造方法 | |
JPH0348459A (ja) | 半導体装置及びその製造方法 | |
JPS61242064A (ja) | 相補型半導体装置の製造方法 | |
JPS6360549B2 (ko) | ||
JPH0324069B2 (ko) | ||
JPH01130542A (ja) | 素子間分離領域を有する半導体装置の製造方法 | |
JPS60193371A (ja) | 半導体装置の製造方法 | |
JPH06232351A (ja) | BiCMOS型半導体装置及びその製造方法 | |
JPS61183967A (ja) | 半導体装置の製造方法 | |
JPH10189765A (ja) | 半導体装置の製造方法 | |
JPS6315749B2 (ko) | ||
JPS6211789B2 (ko) | ||
JPH023306B2 (ko) | ||
JPS628028B2 (ko) | ||
JP2513312B2 (ja) | Mosトランジスタの製造方法 | |
JPS628029B2 (ko) | ||
JP2576664B2 (ja) | Npnトランジスタの製造方法 | |
JPH02189965A (ja) | 半導体装置の製造方法 | |
JPS6251248A (ja) | 半導体装置の製造方法 | |
JPS6154661A (ja) | 半導体装置の製造方法 | |
JP2892436B2 (ja) | 半導体装置の製造方法 | |
JPS5972741A (ja) | 半導体装置の製造方法 |