JPS6211510B2 - - Google Patents
Info
- Publication number
- JPS6211510B2 JPS6211510B2 JP14412181A JP14412181A JPS6211510B2 JP S6211510 B2 JPS6211510 B2 JP S6211510B2 JP 14412181 A JP14412181 A JP 14412181A JP 14412181 A JP14412181 A JP 14412181A JP S6211510 B2 JPS6211510 B2 JP S6211510B2
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- heat transfer
- transfer body
- cooling module
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 7
- 239000002826 coolant Substances 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910017773 Cu-Zn-Al Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14412181A JPS5844754A (ja) | 1981-09-11 | 1981-09-11 | Lsiパツケ−ジの冷却構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14412181A JPS5844754A (ja) | 1981-09-11 | 1981-09-11 | Lsiパツケ−ジの冷却構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5844754A JPS5844754A (ja) | 1983-03-15 |
JPS6211510B2 true JPS6211510B2 (enrdf_load_stackoverflow) | 1987-03-12 |
Family
ID=15354675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14412181A Granted JPS5844754A (ja) | 1981-09-11 | 1981-09-11 | Lsiパツケ−ジの冷却構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5844754A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4851856A (en) * | 1988-02-16 | 1989-07-25 | Westinghouse Electric Corp. | Flexible diaphragm cooling device for microwave antennas |
-
1981
- 1981-09-11 JP JP14412181A patent/JPS5844754A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5844754A (ja) | 1983-03-15 |
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