JPS6211510B2 - - Google Patents

Info

Publication number
JPS6211510B2
JPS6211510B2 JP14412181A JP14412181A JPS6211510B2 JP S6211510 B2 JPS6211510 B2 JP S6211510B2 JP 14412181 A JP14412181 A JP 14412181A JP 14412181 A JP14412181 A JP 14412181A JP S6211510 B2 JPS6211510 B2 JP S6211510B2
Authority
JP
Japan
Prior art keywords
lsi
heat transfer
transfer body
cooling module
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14412181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5844754A (ja
Inventor
Tsuneaki Tajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP14412181A priority Critical patent/JPS5844754A/ja
Publication of JPS5844754A publication Critical patent/JPS5844754A/ja
Publication of JPS6211510B2 publication Critical patent/JPS6211510B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP14412181A 1981-09-11 1981-09-11 Lsiパツケ−ジの冷却構造 Granted JPS5844754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14412181A JPS5844754A (ja) 1981-09-11 1981-09-11 Lsiパツケ−ジの冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14412181A JPS5844754A (ja) 1981-09-11 1981-09-11 Lsiパツケ−ジの冷却構造

Publications (2)

Publication Number Publication Date
JPS5844754A JPS5844754A (ja) 1983-03-15
JPS6211510B2 true JPS6211510B2 (enrdf_load_stackoverflow) 1987-03-12

Family

ID=15354675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14412181A Granted JPS5844754A (ja) 1981-09-11 1981-09-11 Lsiパツケ−ジの冷却構造

Country Status (1)

Country Link
JP (1) JPS5844754A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851856A (en) * 1988-02-16 1989-07-25 Westinghouse Electric Corp. Flexible diaphragm cooling device for microwave antennas

Also Published As

Publication number Publication date
JPS5844754A (ja) 1983-03-15

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