JPH0354472B2 - - Google Patents
Info
- Publication number
- JPH0354472B2 JPH0354472B2 JP14163183A JP14163183A JPH0354472B2 JP H0354472 B2 JPH0354472 B2 JP H0354472B2 JP 14163183 A JP14163183 A JP 14163183A JP 14163183 A JP14163183 A JP 14163183A JP H0354472 B2 JPH0354472 B2 JP H0354472B2
- Authority
- JP
- Japan
- Prior art keywords
- conduit
- integrated circuit
- cooling
- heat sink
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 10
- 239000003507 refrigerant Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000000110 cooling liquid Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14163183A JPS6032349A (ja) | 1983-08-02 | 1983-08-02 | 集積回路パツケ−ジの冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14163183A JPS6032349A (ja) | 1983-08-02 | 1983-08-02 | 集積回路パツケ−ジの冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6032349A JPS6032349A (ja) | 1985-02-19 |
| JPH0354472B2 true JPH0354472B2 (enrdf_load_stackoverflow) | 1991-08-20 |
Family
ID=15296527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14163183A Granted JPS6032349A (ja) | 1983-08-02 | 1983-08-02 | 集積回路パツケ−ジの冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6032349A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2716129B2 (ja) * | 1987-07-24 | 1998-02-18 | 日本電気株式会社 | 集積回路の冷却構造 |
| JP2786193B2 (ja) * | 1987-10-26 | 1998-08-13 | 株式会社日立製作所 | 半導体冷却装置 |
| JPH036848A (ja) * | 1989-06-03 | 1991-01-14 | Hitachi Ltd | 半導体冷却モジュール |
| US6665180B2 (en) | 2001-06-22 | 2003-12-16 | International Business Machines Corporation | System for cooling a component in a computer system |
| JP4682938B2 (ja) * | 2006-07-07 | 2011-05-11 | 株式会社デンソー | 積層型冷却器 |
-
1983
- 1983-08-02 JP JP14163183A patent/JPS6032349A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6032349A (ja) | 1985-02-19 |
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