JPH0342512B2 - - Google Patents

Info

Publication number
JPH0342512B2
JPH0342512B2 JP59109486A JP10948684A JPH0342512B2 JP H0342512 B2 JPH0342512 B2 JP H0342512B2 JP 59109486 A JP59109486 A JP 59109486A JP 10948684 A JP10948684 A JP 10948684A JP H0342512 B2 JPH0342512 B2 JP H0342512B2
Authority
JP
Japan
Prior art keywords
liquid
metal
package
semiconductor chip
bottom plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59109486A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60254641A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10948684A priority Critical patent/JPS60254641A/ja
Publication of JPS60254641A publication Critical patent/JPS60254641A/ja
Publication of JPH0342512B2 publication Critical patent/JPH0342512B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10948684A 1984-05-31 1984-05-31 液体封入型パツケ−ジ Granted JPS60254641A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10948684A JPS60254641A (ja) 1984-05-31 1984-05-31 液体封入型パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10948684A JPS60254641A (ja) 1984-05-31 1984-05-31 液体封入型パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS60254641A JPS60254641A (ja) 1985-12-16
JPH0342512B2 true JPH0342512B2 (enrdf_load_stackoverflow) 1991-06-27

Family

ID=14511462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10948684A Granted JPS60254641A (ja) 1984-05-31 1984-05-31 液体封入型パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS60254641A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016882A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
WO1993016883A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
US8213431B2 (en) 2008-01-18 2012-07-03 The Boeing Company System and method for enabling wireless real time applications over a wide area network in high signal intermittence environments
WO1993023825A1 (en) * 1992-05-20 1993-11-25 Seiko Epson Corporation Cartridge for electronic apparatus
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
DE10129006B4 (de) * 2001-06-15 2009-07-30 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
US7157793B2 (en) 2003-11-12 2007-01-02 U.S. Monolithics, L.L.C. Direct contact semiconductor cooling

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875860A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 冷媒封入型半導体装置

Also Published As

Publication number Publication date
JPS60254641A (ja) 1985-12-16

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees