JPS60254641A - 液体封入型パツケ−ジ - Google Patents

液体封入型パツケ−ジ

Info

Publication number
JPS60254641A
JPS60254641A JP10948684A JP10948684A JPS60254641A JP S60254641 A JPS60254641 A JP S60254641A JP 10948684 A JP10948684 A JP 10948684A JP 10948684 A JP10948684 A JP 10948684A JP S60254641 A JPS60254641 A JP S60254641A
Authority
JP
Japan
Prior art keywords
package
liquid
semiconductor chip
bottom plate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10948684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342512B2 (enrdf_load_stackoverflow
Inventor
Kishio Yokouchi
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10948684A priority Critical patent/JPS60254641A/ja
Publication of JPS60254641A publication Critical patent/JPS60254641A/ja
Publication of JPH0342512B2 publication Critical patent/JPH0342512B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10948684A 1984-05-31 1984-05-31 液体封入型パツケ−ジ Granted JPS60254641A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10948684A JPS60254641A (ja) 1984-05-31 1984-05-31 液体封入型パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10948684A JPS60254641A (ja) 1984-05-31 1984-05-31 液体封入型パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS60254641A true JPS60254641A (ja) 1985-12-16
JPH0342512B2 JPH0342512B2 (enrdf_load_stackoverflow) 1991-06-27

Family

ID=14511462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10948684A Granted JPS60254641A (ja) 1984-05-31 1984-05-31 液体封入型パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS60254641A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016882A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
WO1993016883A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US6025993A (en) * 1992-05-20 2000-02-15 Seiko Epson Corporation Cartridge for electronic devices
US6339191B1 (en) * 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
WO2005053022A1 (en) * 2003-11-12 2005-06-09 U. S. Monolithics, L.L.C. Direct contact fluid cooling for semiconductor device
DE10129006B4 (de) * 2001-06-15 2009-07-30 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
US7804688B2 (en) 1992-05-20 2010-09-28 Seiko Epson Corporation Apparatus including processor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875860A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 冷媒封入型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875860A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 冷媒封入型半導体装置

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016882A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
WO1993016883A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
US5437041A (en) * 1992-02-26 1995-07-25 Seiko Epson Corporation Device and method for exerting force on circuit mounted on board through opening of the board to facilitate the thermal conduction between circuit and housing
US5615085A (en) * 1992-02-26 1997-03-25 Seiko Epson Corporation Temperature control for add-on electronic devices
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US7359202B2 (en) 1992-05-20 2008-04-15 Seiko Epson Corporation Printer apparatus
US7804688B2 (en) 1992-05-20 2010-09-28 Seiko Epson Corporation Apparatus including processor
US6404639B1 (en) 1992-05-20 2002-06-11 Seiko Epson Corporation Cartridge for electronic devices
US6515864B2 (en) 1992-05-20 2003-02-04 Seiko Epson Corporation Cartridge for electronic devices
US6608753B2 (en) 1992-05-20 2003-08-19 Seiko Epson Corporation Cartridge for electronic devices
US7583505B2 (en) 1992-05-20 2009-09-01 Seiko Epson Corporation Processor apparatus
US6025993A (en) * 1992-05-20 2000-02-15 Seiko Epson Corporation Cartridge for electronic devices
US7345883B2 (en) 1992-05-20 2008-03-18 Seiko Epson Corporation Processing device
US7035108B2 (en) 1992-05-20 2006-04-25 Seiko Epson Corporation Information processing device
US6977432B2 (en) 1994-03-11 2005-12-20 Quantum Leap Packaging, Inc. Prefabricated semiconductor chip carrier
US6828511B2 (en) 1994-03-11 2004-12-07 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US6339191B1 (en) * 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
DE10129006B4 (de) * 2001-06-15 2009-07-30 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
US7157793B2 (en) 2003-11-12 2007-01-02 U.S. Monolithics, L.L.C. Direct contact semiconductor cooling
WO2005053022A1 (en) * 2003-11-12 2005-06-09 U. S. Monolithics, L.L.C. Direct contact fluid cooling for semiconductor device

Also Published As

Publication number Publication date
JPH0342512B2 (enrdf_load_stackoverflow) 1991-06-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees