JPH0342702B2 - - Google Patents

Info

Publication number
JPH0342702B2
JPH0342702B2 JP60120439A JP12043985A JPH0342702B2 JP H0342702 B2 JPH0342702 B2 JP H0342702B2 JP 60120439 A JP60120439 A JP 60120439A JP 12043985 A JP12043985 A JP 12043985A JP H0342702 B2 JPH0342702 B2 JP H0342702B2
Authority
JP
Japan
Prior art keywords
chip
substrate
heat transfer
integrated circuit
transfer body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60120439A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61279156A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60120439A priority Critical patent/JPS61279156A/ja
Publication of JPS61279156A publication Critical patent/JPS61279156A/ja
Publication of JPH0342702B2 publication Critical patent/JPH0342702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60120439A 1985-06-05 1985-06-05 マルチチツプモジユ−ル Granted JPS61279156A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60120439A JPS61279156A (ja) 1985-06-05 1985-06-05 マルチチツプモジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60120439A JPS61279156A (ja) 1985-06-05 1985-06-05 マルチチツプモジユ−ル

Publications (2)

Publication Number Publication Date
JPS61279156A JPS61279156A (ja) 1986-12-09
JPH0342702B2 true JPH0342702B2 (enrdf_load_stackoverflow) 1991-06-28

Family

ID=14786230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60120439A Granted JPS61279156A (ja) 1985-06-05 1985-06-05 マルチチツプモジユ−ル

Country Status (1)

Country Link
JP (1) JPS61279156A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019043835A1 (ja) * 2017-08-30 2020-09-24 日本電気株式会社 電子装置

Also Published As

Publication number Publication date
JPS61279156A (ja) 1986-12-09

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