JPS62114440U - - Google Patents
Info
- Publication number
- JPS62114440U JPS62114440U JP146686U JP146686U JPS62114440U JP S62114440 U JPS62114440 U JP S62114440U JP 146686 U JP146686 U JP 146686U JP 146686 U JP146686 U JP 146686U JP S62114440 U JPS62114440 U JP S62114440U
- Authority
- JP
- Japan
- Prior art keywords
- resin package
- mold structure
- mold
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000001721 transfer moulding Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP146686U JPS62114440U (ru) | 1986-01-09 | 1986-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP146686U JPS62114440U (ru) | 1986-01-09 | 1986-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62114440U true JPS62114440U (ru) | 1987-07-21 |
Family
ID=30779401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP146686U Pending JPS62114440U (ru) | 1986-01-09 | 1986-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62114440U (ru) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020068166A (ja) * | 2018-10-26 | 2020-04-30 | 矢崎総業株式会社 | シールドコネクタ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181024A (ja) * | 1983-03-30 | 1984-10-15 | Nec Corp | 半導体装置の樹脂封止装置 |
| JPS601836A (ja) * | 1983-06-20 | 1985-01-08 | Hitachi Ltd | 樹脂封止用金型 |
-
1986
- 1986-01-09 JP JP146686U patent/JPS62114440U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181024A (ja) * | 1983-03-30 | 1984-10-15 | Nec Corp | 半導体装置の樹脂封止装置 |
| JPS601836A (ja) * | 1983-06-20 | 1985-01-08 | Hitachi Ltd | 樹脂封止用金型 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020068166A (ja) * | 2018-10-26 | 2020-04-30 | 矢崎総業株式会社 | シールドコネクタ |
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