JPS62111452A - 半導体素子塔載用回路基板 - Google Patents

半導体素子塔載用回路基板

Info

Publication number
JPS62111452A
JPS62111452A JP60250481A JP25048185A JPS62111452A JP S62111452 A JPS62111452 A JP S62111452A JP 60250481 A JP60250481 A JP 60250481A JP 25048185 A JP25048185 A JP 25048185A JP S62111452 A JPS62111452 A JP S62111452A
Authority
JP
Japan
Prior art keywords
circuit board
copper circuit
plate
bonded
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60250481A
Other languages
English (en)
Japanese (ja)
Other versions
JPH022290B2 (cg-RX-API-DMAC10.html
Inventor
Masaru Ando
勝 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60250481A priority Critical patent/JPS62111452A/ja
Publication of JPS62111452A publication Critical patent/JPS62111452A/ja
Publication of JPH022290B2 publication Critical patent/JPH022290B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/692—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60250481A 1985-11-08 1985-11-08 半導体素子塔載用回路基板 Granted JPS62111452A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60250481A JPS62111452A (ja) 1985-11-08 1985-11-08 半導体素子塔載用回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60250481A JPS62111452A (ja) 1985-11-08 1985-11-08 半導体素子塔載用回路基板

Publications (2)

Publication Number Publication Date
JPS62111452A true JPS62111452A (ja) 1987-05-22
JPH022290B2 JPH022290B2 (cg-RX-API-DMAC10.html) 1990-01-17

Family

ID=17208495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60250481A Granted JPS62111452A (ja) 1985-11-08 1985-11-08 半導体素子塔載用回路基板

Country Status (1)

Country Link
JP (1) JPS62111452A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288948A (en) * 1989-06-26 1994-02-22 Oki Electric Industry Co., Ltd. Structure of a semiconductor chip having a conductive layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288948A (en) * 1989-06-26 1994-02-22 Oki Electric Industry Co., Ltd. Structure of a semiconductor chip having a conductive layer

Also Published As

Publication number Publication date
JPH022290B2 (cg-RX-API-DMAC10.html) 1990-01-17

Similar Documents

Publication Publication Date Title
US5324892A (en) Method of fabricating an electronic interconnection
JP2002043508A (ja) 半導体装置およびその製造方法
JP7215206B2 (ja) 半導体装置の製造方法
KR102359146B1 (ko) 저항기 및 저항기의 제조 방법
JPS62128533A (ja) はんだプリフオ−ム及びその使用方法
JP3816821B2 (ja) 高周波用パワーモジュール基板及びその製造方法
JPS62111452A (ja) 半導体素子塔載用回路基板
JP4085563B2 (ja) パワー半導体モジュールの製造方法
JPWO2019167942A1 (ja) 絶縁回路基板
JPS6348901A (ja) マイクロ波デバイス
JP2851779B2 (ja) 電子部品の実装方法
JP6930317B2 (ja) 端子ピンの接合方法及び接合用冶具
JPH0677631A (ja) チップ部品のアルミ基板への実装方法
JP3984107B2 (ja) 高周波用半導体素子収納用パッケージの製造方法
JP2576531B2 (ja) ハイブリッドｉｃ
JP4434979B2 (ja) 半導体パッケージの製造方法
JP3021896B2 (ja) 複合半導体装置の製造方法
JPH0590460A (ja) 半導体装置の製造方法
JPH0344414B2 (cg-RX-API-DMAC10.html)
WO2024150370A1 (ja) 絶縁基板および半導体装置
JPS6199359A (ja) 混成集積回路装置
JP2000151034A (ja) セラミック回路基板
JPH05299784A (ja) セラミック誘電体基板
JPH10321669A (ja) 電子部品の実装方法および実装構造
JPH0590984U (ja) 印刷回路基板