JPS62106642A - ウェハリングの供給・返送方法 - Google Patents
ウェハリングの供給・返送方法Info
- Publication number
- JPS62106642A JPS62106642A JP24626385A JP24626385A JPS62106642A JP S62106642 A JPS62106642 A JP S62106642A JP 24626385 A JP24626385 A JP 24626385A JP 24626385 A JP24626385 A JP 24626385A JP S62106642 A JPS62106642 A JP S62106642A
- Authority
- JP
- Japan
- Prior art keywords
- wafer ring
- wafer
- cassette
- storage section
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims description 47
- 238000000605 extraction Methods 0.000 claims description 28
- 238000012840 feeding operation Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 210000000078 claw Anatomy 0.000 description 17
- 241000257465 Echinoidea Species 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- 239000000872 buffer Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Special Conveying (AREA)
- De-Stacking Of Articles (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24626385A JPS62106642A (ja) | 1985-11-05 | 1985-11-05 | ウェハリングの供給・返送方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24626385A JPS62106642A (ja) | 1985-11-05 | 1985-11-05 | ウェハリングの供給・返送方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62106642A true JPS62106642A (ja) | 1987-05-18 |
| JPH0543184B2 JPH0543184B2 (enrdf_load_stackoverflow) | 1993-06-30 |
Family
ID=17145917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24626385A Granted JPS62106642A (ja) | 1985-11-05 | 1985-11-05 | ウェハリングの供給・返送方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62106642A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5556248A (en) * | 1993-01-14 | 1996-09-17 | Applied Materials, Inc. | Semiconductor wafer cassette transfer system |
| US5725728A (en) * | 1995-09-18 | 1998-03-10 | Kabushiki Kaisha Shinkawa | Pellet pick-up device |
| US5824185A (en) * | 1995-08-18 | 1998-10-20 | Kabushiki Kaisha Shinkawa | Wafer ring supply and return device |
| US5853532A (en) * | 1995-08-18 | 1998-12-29 | Kabushiki Kaisha Shinkawa | Wafer ring supply and return device |
| US6062795A (en) * | 1996-10-01 | 2000-05-16 | Kabushiki Kaisha Shinkawa | Wafer ring feeding apparatus |
| KR20180021492A (ko) * | 2016-08-22 | 2018-03-05 | 세메스 주식회사 | 웨이퍼링 이송 장치 |
-
1985
- 1985-11-05 JP JP24626385A patent/JPS62106642A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5556248A (en) * | 1993-01-14 | 1996-09-17 | Applied Materials, Inc. | Semiconductor wafer cassette transfer system |
| US5824185A (en) * | 1995-08-18 | 1998-10-20 | Kabushiki Kaisha Shinkawa | Wafer ring supply and return device |
| US5853532A (en) * | 1995-08-18 | 1998-12-29 | Kabushiki Kaisha Shinkawa | Wafer ring supply and return device |
| US5725728A (en) * | 1995-09-18 | 1998-03-10 | Kabushiki Kaisha Shinkawa | Pellet pick-up device |
| US6062795A (en) * | 1996-10-01 | 2000-05-16 | Kabushiki Kaisha Shinkawa | Wafer ring feeding apparatus |
| KR20180021492A (ko) * | 2016-08-22 | 2018-03-05 | 세메스 주식회사 | 웨이퍼링 이송 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543184B2 (enrdf_load_stackoverflow) | 1993-06-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |