JPS6210590B2 - - Google Patents

Info

Publication number
JPS6210590B2
JPS6210590B2 JP56041228A JP4122881A JPS6210590B2 JP S6210590 B2 JPS6210590 B2 JP S6210590B2 JP 56041228 A JP56041228 A JP 56041228A JP 4122881 A JP4122881 A JP 4122881A JP S6210590 B2 JPS6210590 B2 JP S6210590B2
Authority
JP
Japan
Prior art keywords
heat
thickness
adhesive layer
pressure
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56041228A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57155277A (en
Inventor
Toshiharu Konishi
Yukio Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP56041228A priority Critical patent/JPS57155277A/ja
Publication of JPS57155277A publication Critical patent/JPS57155277A/ja
Publication of JPS6210590B2 publication Critical patent/JPS6210590B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
JP56041228A 1981-03-19 1981-03-19 Heat transfer tape Granted JPS57155277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56041228A JPS57155277A (en) 1981-03-19 1981-03-19 Heat transfer tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56041228A JPS57155277A (en) 1981-03-19 1981-03-19 Heat transfer tape

Publications (2)

Publication Number Publication Date
JPS57155277A JPS57155277A (en) 1982-09-25
JPS6210590B2 true JPS6210590B2 (cg-RX-API-DMAC7.html) 1987-03-06

Family

ID=12602548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56041228A Granted JPS57155277A (en) 1981-03-19 1981-03-19 Heat transfer tape

Country Status (1)

Country Link
JP (1) JPS57155277A (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4086946B2 (ja) * 1998-01-05 2008-05-14 日東電工株式会社 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
KR20020032468A (ko) * 2002-03-13 2002-05-03 민병이 합성수지제 난방 파이프
EP1433829A1 (en) * 2002-12-23 2004-06-30 3M Innovative Properties Company Thermally-formable and cross-linkable precursor of a thermally conductive material
JP5081619B2 (ja) * 2004-08-07 2012-11-28 ウオーターズ・テクノロジーズ・コーポレイシヨン サンプル帯域拡張を減少させる特徴を有する受動式カラム予熱器
CN105987622B (zh) * 2015-01-28 2018-08-31 广州市华德工业有限公司 板管复合换热型蒸发式冷凝器

Also Published As

Publication number Publication date
JPS57155277A (en) 1982-09-25

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