JPS57155277A - Heat transfer tape - Google Patents

Heat transfer tape

Info

Publication number
JPS57155277A
JPS57155277A JP56041228A JP4122881A JPS57155277A JP S57155277 A JPS57155277 A JP S57155277A JP 56041228 A JP56041228 A JP 56041228A JP 4122881 A JP4122881 A JP 4122881A JP S57155277 A JPS57155277 A JP S57155277A
Authority
JP
Japan
Prior art keywords
sensitive adhesive
pressure
thickness
adhesive layer
continuously
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56041228A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6210590B2 (cg-RX-API-DMAC7.html
Inventor
Toshiharu Konishi
Yukio Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP56041228A priority Critical patent/JPS57155277A/ja
Publication of JPS57155277A publication Critical patent/JPS57155277A/ja
Publication of JPS6210590B2 publication Critical patent/JPS6210590B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
JP56041228A 1981-03-19 1981-03-19 Heat transfer tape Granted JPS57155277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56041228A JPS57155277A (en) 1981-03-19 1981-03-19 Heat transfer tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56041228A JPS57155277A (en) 1981-03-19 1981-03-19 Heat transfer tape

Publications (2)

Publication Number Publication Date
JPS57155277A true JPS57155277A (en) 1982-09-25
JPS6210590B2 JPS6210590B2 (cg-RX-API-DMAC7.html) 1987-03-06

Family

ID=12602548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56041228A Granted JPS57155277A (en) 1981-03-19 1981-03-19 Heat transfer tape

Country Status (1)

Country Link
JP (1) JPS57155277A (cg-RX-API-DMAC7.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0928027A3 (en) * 1998-01-05 2000-03-15 Nitto Denko Corporation Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same
KR20020032468A (ko) * 2002-03-13 2002-05-03 민병이 합성수지제 난방 파이프
JP2007524713A (ja) * 2002-12-23 2007-08-30 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性材料の熱成形性でかつ架橋性の前駆物質
JP2008509401A (ja) * 2004-08-07 2008-03-27 ウオーターズ・インベストメンツ・リミテツド サンプル帯域拡張を減少させる特徴を有する受動式カラム予熱器
EP3252416A4 (en) * 2015-01-28 2018-01-03 Guangzhou Wide Industrial Co., Ltd Compound heat exchange evaporative condenser of board pipe

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0928027A3 (en) * 1998-01-05 2000-03-15 Nitto Denko Corporation Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same
KR20020032468A (ko) * 2002-03-13 2002-05-03 민병이 합성수지제 난방 파이프
JP2007524713A (ja) * 2002-12-23 2007-08-30 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性材料の熱成形性でかつ架橋性の前駆物質
JP2008509401A (ja) * 2004-08-07 2008-03-27 ウオーターズ・インベストメンツ・リミテツド サンプル帯域拡張を減少させる特徴を有する受動式カラム予熱器
US8956534B2 (en) 2004-08-07 2015-02-17 Waters Technologies Corporation Passive column pre-heater with sample band spreading reduction feature
EP3252416A4 (en) * 2015-01-28 2018-01-03 Guangzhou Wide Industrial Co., Ltd Compound heat exchange evaporative condenser of board pipe

Also Published As

Publication number Publication date
JPS6210590B2 (cg-RX-API-DMAC7.html) 1987-03-06

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