JPS57155277A - Heat transfer tape - Google Patents

Heat transfer tape

Info

Publication number
JPS57155277A
JPS57155277A JP4122881A JP4122881A JPS57155277A JP S57155277 A JPS57155277 A JP S57155277A JP 4122881 A JP4122881 A JP 4122881A JP 4122881 A JP4122881 A JP 4122881A JP S57155277 A JPS57155277 A JP S57155277A
Authority
JP
Japan
Prior art keywords
sensitive adhesive
pressure
thickness
adhesive layer
continuously
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4122881A
Other languages
Japanese (ja)
Other versions
JPS6210590B2 (en
Inventor
Toshiharu Konishi
Yukio Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP4122881A priority Critical patent/JPS57155277A/en
Publication of JPS57155277A publication Critical patent/JPS57155277A/en
Publication of JPS6210590B2 publication Critical patent/JPS6210590B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:The titled tape, prepared by continuously placing a specific thin layer of a pressure-sensitive adhesive on an area in contact with a radiator on one side of a flexible heat transfer support, and continuously placing a pressure- sensitive adhesive layer of specific thickness on other areas alternately, and having improved heat conductivity and supporting force for the heat radiation. CONSTITUTION:A pressure-sensitive adhesive layer (4A) having a thickness <=0.01mm., preferably 1-3mu, is continuously placed on an area (3A) in contact with a member, e.g. a refrigerant flow pipe 20, requiring the heat radiation on one side of a flexible support 1, e.g. aluminum or copper foil, having the heat conductivity, and a pressure-sensitive adhesive layer (4B) having a thickness >=0.02mm. is continuously placed alternately on other areas to give the aimed tape (A). A composite film of a plastic with a metallic film may be used as the support 1. An acrylic ester polymer or silicone rubber is preferred as the pressure-sensitive adhesive.
JP4122881A 1981-03-19 1981-03-19 Heat transfer tape Granted JPS57155277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4122881A JPS57155277A (en) 1981-03-19 1981-03-19 Heat transfer tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4122881A JPS57155277A (en) 1981-03-19 1981-03-19 Heat transfer tape

Publications (2)

Publication Number Publication Date
JPS57155277A true JPS57155277A (en) 1982-09-25
JPS6210590B2 JPS6210590B2 (en) 1987-03-06

Family

ID=12602548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4122881A Granted JPS57155277A (en) 1981-03-19 1981-03-19 Heat transfer tape

Country Status (1)

Country Link
JP (1) JPS57155277A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0928027A2 (en) * 1998-01-05 1999-07-07 Nitto Denko Corporation Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same
KR20020032468A (en) * 2002-03-13 2002-05-03 민병이 Synthetic heating pipe
JP2007524713A (en) * 2002-12-23 2007-08-30 スリーエム イノベイティブ プロパティズ カンパニー Thermoformable and crosslinkable precursors of thermally conductive materials
JP2008509401A (en) * 2004-08-07 2008-03-27 ウオーターズ・インベストメンツ・リミテツド Passive column preheater with features that reduce sample bandwidth expansion
EP3252416A4 (en) * 2015-01-28 2018-01-03 Guangzhou Wide Industrial Co., Ltd Compound heat exchange evaporative condenser of board pipe

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0928027A2 (en) * 1998-01-05 1999-07-07 Nitto Denko Corporation Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same
EP0928027A3 (en) * 1998-01-05 2000-03-15 Nitto Denko Corporation Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same
KR20020032468A (en) * 2002-03-13 2002-05-03 민병이 Synthetic heating pipe
JP2007524713A (en) * 2002-12-23 2007-08-30 スリーエム イノベイティブ プロパティズ カンパニー Thermoformable and crosslinkable precursors of thermally conductive materials
JP2008509401A (en) * 2004-08-07 2008-03-27 ウオーターズ・インベストメンツ・リミテツド Passive column preheater with features that reduce sample bandwidth expansion
US8956534B2 (en) 2004-08-07 2015-02-17 Waters Technologies Corporation Passive column pre-heater with sample band spreading reduction feature
EP3252416A4 (en) * 2015-01-28 2018-01-03 Guangzhou Wide Industrial Co., Ltd Compound heat exchange evaporative condenser of board pipe

Also Published As

Publication number Publication date
JPS6210590B2 (en) 1987-03-06

Similar Documents

Publication Publication Date Title
ATE122898T1 (en) CURRENT RESIN-COVERED FILM WITH REDUCED ADHESIVENESS.
AU553295B2 (en) Embossed film with matte surface
EP0507332A3 (en) Laminate
DE69937479D1 (en) Thin film compensator with polymerized liquid crystals in planar arrangement in the air interface
JPS5710098A (en) Heat exchanger made of aluminum
ES2143667T3 (en) REFLECTIVE FOAM COATING.
TW200419751A (en) Heat radiation sheet
JPS5789785A (en) Fixing roller
GB2021295A (en) Metallized decorative film laminate and process
ES520264A0 (en) A CATHODIC SPRAY SYSTEM FOR MAGNETRON.
DE3278999D1 (en) Flexible selective energy control sheet and assembly using the same
JPS57155277A (en) Heat transfer tape
CA2121443A1 (en) Textured Surface with Canted Channels for an Automatic Tray Processor
ATE22581T1 (en) FORMING COATING WITH HIGH FRICTION RESISTANCE.
ES483038A1 (en) Element for Absorbing Solar Radiation
JPS54138384A (en) Semiconductor pressure converter
DE3676249D1 (en) MULTI-HEATING EYE DEVICE FOR LINEAR JET PIPES WITH IMPROVED COOLING AND EVAPORATION SURFACES.
CN2380884Y (en) Improved heating-circular-tube radiating-fin
JPS55152775A (en) Pressure-sensitive double-side adhesive tape
AU6929296A (en) Thermal solar-energy collector
CN210491525U (en) Novel super thick heat conduction structure
JPS57138064A (en) Optical disc medium
JPS57155278A (en) Rust preventing adhesive tape or sheet
JPS52114632A (en) Pressure sensitive adhesive tape or sheet
FR2363436A1 (en) Metal film resistors and similar electronic components - made by cold isostatic pressing of metal foil onto ceramic tube