JPS6197939A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6197939A
JPS6197939A JP59219911A JP21991184A JPS6197939A JP S6197939 A JPS6197939 A JP S6197939A JP 59219911 A JP59219911 A JP 59219911A JP 21991184 A JP21991184 A JP 21991184A JP S6197939 A JPS6197939 A JP S6197939A
Authority
JP
Japan
Prior art keywords
bonding pad
potential
wiring
input
vss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59219911A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416014B2 (enExample
Inventor
Satoru Negishi
哲 根岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59219911A priority Critical patent/JPS6197939A/ja
Publication of JPS6197939A publication Critical patent/JPS6197939A/ja
Publication of JPH0416014B2 publication Critical patent/JPH0416014B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP59219911A 1984-10-19 1984-10-19 半導体装置 Granted JPS6197939A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59219911A JPS6197939A (ja) 1984-10-19 1984-10-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59219911A JPS6197939A (ja) 1984-10-19 1984-10-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS6197939A true JPS6197939A (ja) 1986-05-16
JPH0416014B2 JPH0416014B2 (enExample) 1992-03-19

Family

ID=16742949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59219911A Granted JPS6197939A (ja) 1984-10-19 1984-10-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS6197939A (enExample)

Also Published As

Publication number Publication date
JPH0416014B2 (enExample) 1992-03-19

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