JPS6197854A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6197854A
JPS6197854A JP59219207A JP21920784A JPS6197854A JP S6197854 A JPS6197854 A JP S6197854A JP 59219207 A JP59219207 A JP 59219207A JP 21920784 A JP21920784 A JP 21920784A JP S6197854 A JPS6197854 A JP S6197854A
Authority
JP
Japan
Prior art keywords
chip
memory cell
arrays
semiconductor device
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59219207A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0358544B2 (enrdf_load_stackoverflow
Inventor
Isao Ogura
庸 小倉
Fumio Horiguchi
文男 堀口
Shigeyoshi Watanabe
重佳 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59219207A priority Critical patent/JPS6197854A/ja
Publication of JPS6197854A publication Critical patent/JPS6197854A/ja
Publication of JPH0358544B2 publication Critical patent/JPH0358544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Dram (AREA)
JP59219207A 1984-10-18 1984-10-18 半導体装置 Granted JPS6197854A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59219207A JPS6197854A (ja) 1984-10-18 1984-10-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59219207A JPS6197854A (ja) 1984-10-18 1984-10-18 半導体装置

Publications (2)

Publication Number Publication Date
JPS6197854A true JPS6197854A (ja) 1986-05-16
JPH0358544B2 JPH0358544B2 (enrdf_load_stackoverflow) 1991-09-05

Family

ID=16731882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59219207A Granted JPS6197854A (ja) 1984-10-18 1984-10-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS6197854A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184208A (en) * 1987-06-30 1993-02-02 Hitachi, Ltd. Semiconductor device
US5365113A (en) * 1987-06-30 1994-11-15 Hitachi, Ltd. Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6140053A (ja) * 1984-07-31 1986-02-26 Toshiba Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6140053A (ja) * 1984-07-31 1986-02-26 Toshiba Corp 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5184208A (en) * 1987-06-30 1993-02-02 Hitachi, Ltd. Semiconductor device
US5365113A (en) * 1987-06-30 1994-11-15 Hitachi, Ltd. Semiconductor device
US5514905A (en) * 1987-06-30 1996-05-07 Hitachi, Ltd. Semiconductor device
US5742101A (en) * 1987-06-30 1998-04-21 Hitachi, Ltd. Semiconductor device

Also Published As

Publication number Publication date
JPH0358544B2 (enrdf_load_stackoverflow) 1991-09-05

Similar Documents

Publication Publication Date Title
US6075284A (en) Stack package
US7848153B2 (en) High speed memory architecture
US20020088633A1 (en) Multi-chip memory devices, modules and control methods including independent control of memory chips
CN108962301B (zh) 一种存储装置
JP2004221215A (ja) 半導体装置
KR970006529B1 (ko) 반도체 장치
JP2647023B2 (ja) 半導体記憶装置
US11594522B2 (en) Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
JP2006318634A (ja) 積層型半導体メモリ装置
US6818983B2 (en) Semiconductor memory chip and semiconductor memory device using the same
US6121681A (en) Semiconductor device
JPS6140053A (ja) 半導体装置
JPS6197854A (ja) 半導体装置
US6229726B1 (en) Integrated circuit chip having multiple package options
US6147924A (en) Arrangement of data input/output circuits for use in a semiconductor memory device
US9226398B1 (en) Printed circuit board and package substrate having additional conductive pathway space
CN110061002B (zh) 一种存储器件
JPH1154693A (ja) 半導体装置
JPH0231454A (ja) 半導体装置
JP2748940B2 (ja) 樹脂封止型半導体装置
JP2001044325A (ja) 半導体装置及び半導体モジュール
JPS59139660A (ja) 半導体装置
KR0163307B1 (ko) 고밀도 실장용 반도체 칩 패키지
JPS62158359A (ja) 半導体装置
KR100306967B1 (ko) 반도체메모리집적회로장치의데이터입/출력회로배열

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term