JPS6186943U - - Google Patents

Info

Publication number
JPS6186943U
JPS6186943U JP17209584U JP17209584U JPS6186943U JP S6186943 U JPS6186943 U JP S6186943U JP 17209584 U JP17209584 U JP 17209584U JP 17209584 U JP17209584 U JP 17209584U JP S6186943 U JPS6186943 U JP S6186943U
Authority
JP
Japan
Prior art keywords
wiring electrode
metal film
semiconductor device
wiring
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17209584U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17209584U priority Critical patent/JPS6186943U/ja
Publication of JPS6186943U publication Critical patent/JPS6186943U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例を示す半導体装置の配
線電極構造説明図、第2図は従来の半導体装置の
配線電極構造説明図である。 1……半導体基板、2……素子領域、7……2
層目配線電極層、50……1層目配線電極層、5
1……第1の高融点金属膜、52……金属膜、5
3……第2の高融点金属膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁層により互いに分離される少なくとも2層
    以上の配線電極層を、半導体基板上に積層状態で
    配設するようにした半導体装置の電極配線構造に
    おいて、少なくとも最下層の1層目配線電極層は
    、アルミまたはアルミを含む合金からなる金属膜
    と、この金属膜の上下にバリヤとして配置される
    高融点金属膜との三層で形成したことを特徴とす
    る半導体装置の配線電極構造。
JP17209584U 1984-11-13 1984-11-13 Pending JPS6186943U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17209584U JPS6186943U (ja) 1984-11-13 1984-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17209584U JPS6186943U (ja) 1984-11-13 1984-11-13

Publications (1)

Publication Number Publication Date
JPS6186943U true JPS6186943U (ja) 1986-06-07

Family

ID=30729771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17209584U Pending JPS6186943U (ja) 1984-11-13 1984-11-13

Country Status (1)

Country Link
JP (1) JPS6186943U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343349A (ja) * 1986-08-08 1988-02-24 Matsushita Electric Ind Co Ltd 多層薄膜配線及びその形成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137231A (ja) * 1982-02-09 1983-08-15 Nec Corp 集積回路装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137231A (ja) * 1982-02-09 1983-08-15 Nec Corp 集積回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343349A (ja) * 1986-08-08 1988-02-24 Matsushita Electric Ind Co Ltd 多層薄膜配線及びその形成方法

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