JPH0224541U - - Google Patents

Info

Publication number
JPH0224541U
JPH0224541U JP10147188U JP10147188U JPH0224541U JP H0224541 U JPH0224541 U JP H0224541U JP 10147188 U JP10147188 U JP 10147188U JP 10147188 U JP10147188 U JP 10147188U JP H0224541 U JPH0224541 U JP H0224541U
Authority
JP
Japan
Prior art keywords
silicon
melting point
high melting
point metal
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10147188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10147188U priority Critical patent/JPH0224541U/ja
Publication of JPH0224541U publication Critical patent/JPH0224541U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案の構成を概略的に示す構成図、
第2図は本実施例に係る半導体装置の形成過程を
示す工程図、第3図は従来例の構成を示す構成図
である。 1はシリコン半導体基板、2はSiO絶縁膜
、3は多結晶シリコン層、4はTiを含む層、5
は高融点金属のシリサイド層、6は配線である。

Claims (1)

    【実用新案登録請求の範囲】
  1. シリコン半導体層上にTiを含む層を介してT
    i以外の高融点金属のシリコン化合物が形成され
    た多層構造の配線を有する半導体装置。
JP10147188U 1988-07-30 1988-07-30 Pending JPH0224541U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10147188U JPH0224541U (ja) 1988-07-30 1988-07-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10147188U JPH0224541U (ja) 1988-07-30 1988-07-30

Publications (1)

Publication Number Publication Date
JPH0224541U true JPH0224541U (ja) 1990-02-19

Family

ID=31330498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10147188U Pending JPH0224541U (ja) 1988-07-30 1988-07-30

Country Status (1)

Country Link
JP (1) JPH0224541U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255911A (ja) * 1994-12-30 1996-10-01 Siliconix Inc 分布抵抗を低減する厚い金属レイヤを有する縦形パワーmosfet及びその製作方法
JPH08264785A (ja) * 1994-12-30 1996-10-11 Siliconix Inc 集積回路ダイ及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255911A (ja) * 1994-12-30 1996-10-01 Siliconix Inc 分布抵抗を低減する厚い金属レイヤを有する縦形パワーmosfet及びその製作方法
JPH08264785A (ja) * 1994-12-30 1996-10-11 Siliconix Inc 集積回路ダイ及びその製造方法

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