JPS6185886A - フレキシブル印刷配線基板の配線交差方法 - Google Patents
フレキシブル印刷配線基板の配線交差方法Info
- Publication number
- JPS6185886A JPS6185886A JP20860284A JP20860284A JPS6185886A JP S6185886 A JPS6185886 A JP S6185886A JP 20860284 A JP20860284 A JP 20860284A JP 20860284 A JP20860284 A JP 20860284A JP S6185886 A JPS6185886 A JP S6185886A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- flexible printed
- wires
- terminals
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20860284A JPS6185886A (ja) | 1984-10-04 | 1984-10-04 | フレキシブル印刷配線基板の配線交差方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20860284A JPS6185886A (ja) | 1984-10-04 | 1984-10-04 | フレキシブル印刷配線基板の配線交差方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6185886A true JPS6185886A (ja) | 1986-05-01 |
| JPH0354874B2 JPH0354874B2 (cg-RX-API-DMAC10.html) | 1991-08-21 |
Family
ID=16558922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20860284A Granted JPS6185886A (ja) | 1984-10-04 | 1984-10-04 | フレキシブル印刷配線基板の配線交差方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185886A (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63106156U (cg-RX-API-DMAC10.html) * | 1986-12-26 | 1988-07-08 | ||
| JPH04223389A (ja) * | 1990-12-25 | 1992-08-13 | Matsushita Electric Ind Co Ltd | フレキシブルプリント基板及びその製造方法 |
| US7151661B2 (en) * | 2001-04-25 | 2006-12-19 | Mitsubishi Denki Kabushiki Kaisha | Capacitor module and semiconductor device using the same |
-
1984
- 1984-10-04 JP JP20860284A patent/JPS6185886A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63106156U (cg-RX-API-DMAC10.html) * | 1986-12-26 | 1988-07-08 | ||
| JPH04223389A (ja) * | 1990-12-25 | 1992-08-13 | Matsushita Electric Ind Co Ltd | フレキシブルプリント基板及びその製造方法 |
| US7151661B2 (en) * | 2001-04-25 | 2006-12-19 | Mitsubishi Denki Kabushiki Kaisha | Capacitor module and semiconductor device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354874B2 (cg-RX-API-DMAC10.html) | 1991-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3633189A (en) | Cable structure for magnetic head assembly | |
| US3034091A (en) | Connector, particularly for flat cable | |
| JP2002203625A (ja) | 平型柔軟回路の導体を電気的接続する装置 | |
| JPS6185886A (ja) | フレキシブル印刷配線基板の配線交差方法 | |
| JPS6185778A (ja) | ホイル回路の接続装置 | |
| JPS59141119A (ja) | 膜スイッチ組立体 | |
| JPH04282618A (ja) | 液晶表示装置 | |
| JPH1116729A (ja) | プリント配線型インダクタンス素子 | |
| JPS6416658U (cg-RX-API-DMAC10.html) | ||
| JP3395868B2 (ja) | テープ電線及びそれを用いた電気接続構造 | |
| JP2006216956A (ja) | 配線構造を有するメモリモジュール | |
| JP3468355B2 (ja) | 半導体装置及び半導体装置システム | |
| JPH0413765Y2 (cg-RX-API-DMAC10.html) | ||
| JP2003187646A (ja) | フラットケーブル及びフラットケーブルを用いた配線構造 | |
| KR940004654Y1 (ko) | 표시장치의 인쇄회로기판용 ic 테이프 | |
| JPS6313506Y2 (cg-RX-API-DMAC10.html) | ||
| JPS58147194A (ja) | 積層回路基板 | |
| JPS5992554A (ja) | 半導体装置 | |
| JPH04289613A (ja) | テープ電線 | |
| JPH04147634A (ja) | 半導体装置用セラミックパッケージ | |
| JPS63187686A (ja) | 基板接続構造 | |
| JPH0955129A (ja) | フレキシブルプリント配線板 | |
| JPS58176318U (ja) | フラツトジヤンパ−線 | |
| JPS6354238B2 (cg-RX-API-DMAC10.html) | ||
| JPH04306620A (ja) | 光シャッタアレイの実装構造 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |