JPS6184025A - 半導体素子表面への皮膜形成方法 - Google Patents
半導体素子表面への皮膜形成方法Info
- Publication number
- JPS6184025A JPS6184025A JP59205253A JP20525384A JPS6184025A JP S6184025 A JPS6184025 A JP S6184025A JP 59205253 A JP59205253 A JP 59205253A JP 20525384 A JP20525384 A JP 20525384A JP S6184025 A JPS6184025 A JP S6184025A
- Authority
- JP
- Japan
- Prior art keywords
- film
- solution
- forming
- polyimide film
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59205253A JPS6184025A (ja) | 1984-09-29 | 1984-09-29 | 半導体素子表面への皮膜形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59205253A JPS6184025A (ja) | 1984-09-29 | 1984-09-29 | 半導体素子表面への皮膜形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6184025A true JPS6184025A (ja) | 1986-04-28 |
| JPH0329292B2 JPH0329292B2 (https=) | 1991-04-23 |
Family
ID=16503923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59205253A Granted JPS6184025A (ja) | 1984-09-29 | 1984-09-29 | 半導体素子表面への皮膜形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6184025A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5094919A (en) * | 1988-06-30 | 1992-03-10 | Nippon Steel Chemical Co., Ltd. | Polyimide copolymers and process for preparing the same |
| JP2002093958A (ja) * | 2000-09-20 | 2002-03-29 | Fuji Electric Co Ltd | 半導体素子の保護膜用ポリイミド樹脂およびそれを用いた半導体装置 |
| JP2023033668A (ja) * | 2021-08-30 | 2023-03-13 | 株式会社 日立パワーデバイス | 半導体装置及びその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143328A (en) * | 1981-02-27 | 1982-09-04 | Nitto Electric Ind Co Ltd | Production of siloxane-modified polyimide precursor |
| JPS5976451A (ja) * | 1982-10-26 | 1984-05-01 | Hitachi Ltd | 半導体装置 |
-
1984
- 1984-09-29 JP JP59205253A patent/JPS6184025A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143328A (en) * | 1981-02-27 | 1982-09-04 | Nitto Electric Ind Co Ltd | Production of siloxane-modified polyimide precursor |
| JPS5976451A (ja) * | 1982-10-26 | 1984-05-01 | Hitachi Ltd | 半導体装置 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5094919A (en) * | 1988-06-30 | 1992-03-10 | Nippon Steel Chemical Co., Ltd. | Polyimide copolymers and process for preparing the same |
| JP2002093958A (ja) * | 2000-09-20 | 2002-03-29 | Fuji Electric Co Ltd | 半導体素子の保護膜用ポリイミド樹脂およびそれを用いた半導体装置 |
| JP2023033668A (ja) * | 2021-08-30 | 2023-03-13 | 株式会社 日立パワーデバイス | 半導体装置及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0329292B2 (https=) | 1991-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03157428A (ja) | コポリイミドから成る絶縁フィルム | |
| KR950011913B1 (ko) | 폴리이미드 수지 용액 조성물 | |
| JP2697215B2 (ja) | 耐熱樹脂ペーストおよびこれを用いたic | |
| JPS63317554A (ja) | 液状ポリイミド樹脂組成物 | |
| JPS5813088B2 (ja) | シロキサン変性ポリイミド前駆体の製造法 | |
| US5714572A (en) | Polyimide resin composition | |
| US20020022310A1 (en) | Epoxy-polyimide composites suitable as encapsulants | |
| JP3055388B2 (ja) | 接着フィルム | |
| JPS6184025A (ja) | 半導体素子表面への皮膜形成方法 | |
| JPH0219862B2 (https=) | ||
| JP2001262116A (ja) | 電子部品用接着性ポリイミド樹脂 | |
| EP0308270B1 (en) | Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof | |
| JPS62135529A (ja) | ポリイミド前駆体 | |
| JPS61166053A (ja) | 半導体装置の製法 | |
| US5376733A (en) | Precursor composition capable of yielding a polyimidesilicone resin | |
| JPH0436321A (ja) | ポリイミドシロキサン組成物および固化膜 | |
| JPH0329174B2 (https=) | ||
| JP2003105199A (ja) | ポリイミド樹脂組成物溶液およびフィルム状接着剤 | |
| JP2004304024A (ja) | 電子部品被覆用ポリイミドフィルム | |
| JPH0277468A (ja) | ポリアミック酸溶液 | |
| JP3012198B2 (ja) | 電気又は電子部品用ポリイミドシロキサン膜の製造方法 | |
| JPH02222473A (ja) | コーティング組成物、及び樹脂封止型半導体装置 | |
| JPS61241360A (ja) | ポリイミド前駆体溶液 | |
| JPS6183229A (ja) | ポリイミド膜形成用樹脂液の製法 | |
| JPH01163214A (ja) | ポリイミドイソインドロキナゾリンジオン及びその前駆体の製造法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |