JPS6183233A - エポキシ樹脂積層板の製造方法 - Google Patents
エポキシ樹脂積層板の製造方法Info
- Publication number
- JPS6183233A JPS6183233A JP20298484A JP20298484A JPS6183233A JP S6183233 A JPS6183233 A JP S6183233A JP 20298484 A JP20298484 A JP 20298484A JP 20298484 A JP20298484 A JP 20298484A JP S6183233 A JPS6183233 A JP S6183233A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- epoxy
- bisphenol
- laminated sheet
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004593 Epoxy Substances 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 34
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 34
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229920003986 novolac Polymers 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 3
- 239000002966 varnish Substances 0.000 claims abstract 3
- 230000035939 shock Effects 0.000 abstract description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 5
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 abstract description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052794 bromium Inorganic materials 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- VXHYVVAUHMGCEX-UHFFFAOYSA-N 2-(2-hydroxyphenoxy)phenol Chemical compound OC1=CC=CC=C1OC1=CC=CC=C1O VXHYVVAUHMGCEX-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20298484A JPS6183233A (ja) | 1984-09-29 | 1984-09-29 | エポキシ樹脂積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20298484A JPS6183233A (ja) | 1984-09-29 | 1984-09-29 | エポキシ樹脂積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183233A true JPS6183233A (ja) | 1986-04-26 |
| JPH0430978B2 JPH0430978B2 (enrdf_load_stackoverflow) | 1992-05-25 |
Family
ID=16466403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20298484A Granted JPS6183233A (ja) | 1984-09-29 | 1984-09-29 | エポキシ樹脂積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183233A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63168439A (ja) * | 1986-12-27 | 1988-07-12 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物 |
| JPS641753A (en) * | 1987-06-24 | 1989-01-06 | Matsushita Electric Works Ltd | Epoxy resin composition for glass-epoxy laminate |
| JP2012532963A (ja) * | 2009-07-10 | 2012-12-20 | ダウ グローバル テクノロジーズ エルエルシー | 電気用積層板組成物における使用のためのコア／シェルゴム |
-
1984
- 1984-09-29 JP JP20298484A patent/JPS6183233A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63168439A (ja) * | 1986-12-27 | 1988-07-12 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物 |
| JPS641753A (en) * | 1987-06-24 | 1989-01-06 | Matsushita Electric Works Ltd | Epoxy resin composition for glass-epoxy laminate |
| JP2012532963A (ja) * | 2009-07-10 | 2012-12-20 | ダウ グローバル テクノロジーズ エルエルシー | 電気用積層板組成物における使用のためのコア／シェルゴム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0430978B2 (enrdf_load_stackoverflow) | 1992-05-25 |
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