JPS6183077U - - Google Patents

Info

Publication number
JPS6183077U
JPS6183077U JP16869684U JP16869684U JPS6183077U JP S6183077 U JPS6183077 U JP S6183077U JP 16869684 U JP16869684 U JP 16869684U JP 16869684 U JP16869684 U JP 16869684U JP S6183077 U JPS6183077 U JP S6183077U
Authority
JP
Japan
Prior art keywords
lead
copper foil
circuit board
printed circuit
foil pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16869684U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16869684U priority Critical patent/JPS6183077U/ja
Publication of JPS6183077U publication Critical patent/JPS6183077U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例におけるプリント基
板装置の断面図、第２図は従来のプリント配線基
板の断面図である。 １……回路構成部品、２……プリント基板、３
……レジストインク、４……銅箔プリントパター
ン、５……銅箔パターン、６……半田、７……シ
ルクインク。 FIG. 1 is a sectional view of a printed circuit board device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional printed wiring board. 1...Circuit component, 2...Printed circuit board, 3
...Resist ink, 4...Copper foil print pattern, 5...Copper foil pattern, 6...Solder, 7...Silk ink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路構成部品のリードをプリント基板に挿入し
、銅箔パターン面にあらわれた上記リードの先端
を折り曲げて仮固定するようにするとともに、上
記リードの折り曲げ方向に位置する銅箔パターン
上にレジストインクを施し、さらにこのレジスト
インク上に色調の異なるシルクインク層を形成し
たプリント基板装置。 Insert the lead of the circuit component into the printed circuit board, bend the tip of the lead that appears on the copper foil pattern surface to temporarily fix it, and apply resist ink on the copper foil pattern located in the bending direction of the lead. A printed circuit board device in which silk ink layers with different tones are formed on top of the resist ink.
JP16869684U 1984-11-07 1984-11-07 Pending JPS6183077U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16869684U JPS6183077U (en) 1984-11-07 1984-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16869684U JPS6183077U (en) 1984-11-07 1984-11-07

Publications (1)

Publication Number Publication Date
JPS6183077U true JPS6183077U (en) 1986-06-02

Family

ID=30726457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16869684U Pending JPS6183077U (en) 1984-11-07 1984-11-07

Country Status (1)

Country Link
JP (1) JPS6183077U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583067B2 (en) * 1974-10-30 1983-01-19 三菱化学株式会社 Senshiyokuhouhou
JPS5818368B2 (en) * 1973-02-16 1983-04-12 バイエル アクチエンゲゼルシヤフト Hatsupojiyushinoseizouhou

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818368B2 (en) * 1973-02-16 1983-04-12 バイエル アクチエンゲゼルシヤフト Hatsupojiyushinoseizouhou
JPS583067B2 (en) * 1974-10-30 1983-01-19 三菱化学株式会社 Senshiyokuhouhou

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