JPS60124064U - Mask for printing solder layer - Google Patents

Mask for printing solder layer

Info

Publication number
JPS60124064U
JPS60124064U JP1241784U JP1241784U JPS60124064U JP S60124064 U JPS60124064 U JP S60124064U JP 1241784 U JP1241784 U JP 1241784U JP 1241784 U JP1241784 U JP 1241784U JP S60124064 U JPS60124064 U JP S60124064U
Authority
JP
Japan
Prior art keywords
solder layer
mask
printing solder
surface side
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1241784U
Other languages
Japanese (ja)
Inventor
瑛一 綱島
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP1241784U priority Critical patent/JPS60124064U/en
Publication of JPS60124064U publication Critical patent/JPS60124064U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は実施例の印刷用マスク断面図、第２図はこの実
施例の印刷用マスクを用いてはんだ層を形成する工程断
面図である。 １・・・マスク構体、２，３・・・開口部、４・・・は
んだクリーム、４　　ａ、　　４　　ｂ・・・はんだク
リーム印刷層、５・・・スキージ、６・・・印刷回路板
、７・・・配線導体層。FIG. 1 is a sectional view of a printing mask of this embodiment, and FIG. 2 is a sectional view of a process of forming a solder layer using the printing mask of this embodiment. DESCRIPTION OF SYMBOLS 1... Mask structure, 2, 3... Opening part, 4... Solder cream, 4 a, 4 b... Solder cream printing layer, 5... Squeegee, 6... Printed circuit board, 7... Wiring conductor layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 下面側で所望の開ロバターンを有し、上面側で前記開ロ
バターンより径大な窓を有して、上面側に広がる形状の
開口部をそなえ、この開口部に蓄え得るはんだクリーム
を吐き出させてはんだ層を形成し得るはんだ層印刷用マ
スク。The lower surface side has a desired opening pattern, the upper surface side has a window with a larger diameter than the opening pattern, and has an opening shaped to widen toward the upper surface side, and the solder cream that can be accumulated in this opening is discharged. A solder layer printing mask that can form a solder layer.
JP1241784U 1984-01-31 1984-01-31 Mask for printing solder layer Pending JPS60124064U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1241784U JPS60124064U (en) 1984-01-31 1984-01-31 Mask for printing solder layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1241784U JPS60124064U (en) 1984-01-31 1984-01-31 Mask for printing solder layer

Publications (1)

Publication Number Publication Date
JPS60124064U true JPS60124064U (en) 1985-08-21

Family

ID=30495458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1241784U Pending JPS60124064U (en) 1984-01-31 1984-01-31 Mask for printing solder layer

Country Status (1)

Country Link
JP (1) JPS60124064U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021149286A1 (en) * 2020-01-22 2021-07-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021149286A1 (en) * 2020-01-22 2021-07-29
WO2021149286A1 (en) * 2020-01-22 2021-07-29 三菱電機株式会社 Method for manufacturing semiconductor device

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