JPS6182451A - Ｉｃパツケ−ジのリ−ド曲げ加工方法 - Google Patents

Ｉｃパツケ−ジのリ−ド曲げ加工方法

Info

Publication number
JPS6182451A
JPS6182451A JP20300984A JP20300984A JPS6182451A JP S6182451 A JPS6182451 A JP S6182451A JP 20300984 A JP20300984 A JP 20300984A JP 20300984 A JP20300984 A JP 20300984A JP S6182451 A JPS6182451 A JP S6182451A
Authority
JP
Japan
Prior art keywords
leads
package
jig
bent
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20300984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0126177B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Kazuhiro Muraki
村木　和寛
Yoji Murakami
洋二 村上
Masao Kobayashi
正夫 小林
Yukihisa Utagawa
歌川　幸寿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Miyachi Systems Co Ltd
Original Assignee
Fujitsu Ltd
Miyachi Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Miyachi Systems Co Ltd filed Critical Fujitsu Ltd
Priority to JP20300984A priority Critical patent/JPS6182451A/ja
Publication of JPS6182451A publication Critical patent/JPS6182451A/ja
Publication of JPH0126177B2 publication Critical patent/JPH0126177B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP20300984A 1984-09-29 1984-09-29 Ｉｃパツケ−ジのリ−ド曲げ加工方法 Granted JPS6182451A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20300984A JPS6182451A (ja) 1984-09-29 1984-09-29 Ｉｃパツケ−ジのリ−ド曲げ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20300984A JPS6182451A (ja) 1984-09-29 1984-09-29 Ｉｃパツケ−ジのリ−ド曲げ加工方法

Publications (2)

Publication Number Publication Date
JPS6182451A true JPS6182451A (ja) 1986-04-26
JPH0126177B2 JPH0126177B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-05-22

Family

ID=16466820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20300984A Granted JPS6182451A (ja) 1984-09-29 1984-09-29 Ｉｃパツケ−ジのリ−ド曲げ加工方法

Country Status (1)

Country Link
JP (1) JPS6182451A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204376A (ja) * 1992-10-17 1994-07-22 M Tex Matsumura Kk 電子部品のリード修正方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509267A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-05-30 1975-01-30
JPS5612398A (en) * 1979-07-11 1981-02-06 Kumiai Chem Ind Co Ltd Organic phosphate derivative, its preparation, and germicide, insecticide and acaricide containing it
JPS5828740A (ja) * 1981-08-13 1983-02-19 Mitsubishi Paper Mills Ltd ハロゲン化銀写真材料の製造方法
JPS6331408U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1986-08-18 1988-03-01
JPS6426177A (en) * 1987-07-22 1989-01-27 Furuno Electric Co Measured position display device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509267A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-05-30 1975-01-30
JPS5612398A (en) * 1979-07-11 1981-02-06 Kumiai Chem Ind Co Ltd Organic phosphate derivative, its preparation, and germicide, insecticide and acaricide containing it
JPS5828740A (ja) * 1981-08-13 1983-02-19 Mitsubishi Paper Mills Ltd ハロゲン化銀写真材料の製造方法
JPS6331408U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1986-08-18 1988-03-01
JPS6426177A (en) * 1987-07-22 1989-01-27 Furuno Electric Co Measured position display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204376A (ja) * 1992-10-17 1994-07-22 M Tex Matsumura Kk 電子部品のリード修正方法

Also Published As

Publication number Publication date
JPH0126177B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-05-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees