JPS6181148U - - Google Patents

Info

Publication number
JPS6181148U
JPS6181148U JP1984165219U JP16521984U JPS6181148U JP S6181148 U JPS6181148 U JP S6181148U JP 1984165219 U JP1984165219 U JP 1984165219U JP 16521984 U JP16521984 U JP 16521984U JP S6181148 U JPS6181148 U JP S6181148U
Authority
JP
Japan
Prior art keywords
heat sink
resin material
electrode plate
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984165219U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984165219U priority Critical patent/JPS6181148U/ja
Publication of JPS6181148U publication Critical patent/JPS6181148U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1984165219U 1984-10-31 1984-10-31 Pending JPS6181148U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984165219U JPS6181148U (enExample) 1984-10-31 1984-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984165219U JPS6181148U (enExample) 1984-10-31 1984-10-31

Publications (1)

Publication Number Publication Date
JPS6181148U true JPS6181148U (enExample) 1986-05-29

Family

ID=30723074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984165219U Pending JPS6181148U (enExample) 1984-10-31 1984-10-31

Country Status (1)

Country Link
JP (1) JPS6181148U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021141209A (ja) * 2020-03-05 2021-09-16 株式会社東芝 半導体パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021141209A (ja) * 2020-03-05 2021-09-16 株式会社東芝 半導体パッケージ

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