JPH02104641U - - Google Patents

Info

Publication number
JPH02104641U
JPH02104641U JP1989012757U JP1275789U JPH02104641U JP H02104641 U JPH02104641 U JP H02104641U JP 1989012757 U JP1989012757 U JP 1989012757U JP 1275789 U JP1275789 U JP 1275789U JP H02104641 U JPH02104641 U JP H02104641U
Authority
JP
Japan
Prior art keywords
insulating board
composite
heat spreader
composite insulating
soldered onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989012757U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989012757U priority Critical patent/JPH02104641U/ja
Publication of JPH02104641U publication Critical patent/JPH02104641U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/884
JP1989012757U 1989-02-06 1989-02-06 Pending JPH02104641U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989012757U JPH02104641U (enExample) 1989-02-06 1989-02-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989012757U JPH02104641U (enExample) 1989-02-06 1989-02-06

Publications (1)

Publication Number Publication Date
JPH02104641U true JPH02104641U (enExample) 1990-08-20

Family

ID=31222487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989012757U Pending JPH02104641U (enExample) 1989-02-06 1989-02-06

Country Status (1)

Country Link
JP (1) JPH02104641U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045399A (ja) * 2009-11-17 2010-02-25 Mitsubishi Electric Corp パワー半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218663B1 (enExample) * 1971-07-16 1977-05-23
JPS61240665A (ja) * 1985-04-17 1986-10-25 Sanyo Electric Co Ltd 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218663B1 (enExample) * 1971-07-16 1977-05-23
JPS61240665A (ja) * 1985-04-17 1986-10-25 Sanyo Electric Co Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045399A (ja) * 2009-11-17 2010-02-25 Mitsubishi Electric Corp パワー半導体装置

Similar Documents

Publication Publication Date Title
JPH02104641U (enExample)
JPS60163738U (ja) 半導体装置
JPS60174244U (ja) 混成集積回路
JPS6130252U (ja) 半導体装置
JPS5874347U (ja) 半導体用絶縁伝熱板
JPH02148569U (enExample)
JPS6255347U (enExample)
JPH0343733U (enExample)
JPH0385654U (enExample)
JPH0221776U (enExample)
JPS6274340U (enExample)
JPH02116740U (enExample)
JPS5899841U (ja) 半導体装置
JPS62204371U (enExample)
JPH0233426U (enExample)
JPH01146548U (enExample)
JPS6294643U (enExample)
JPS6355445U (enExample)
JPH0330440U (enExample)
JPS61140544U (enExample)
JPH0238743U (enExample)
JPS5974757U (ja) 放熱性に優れた回路基板
JPH01121969U (enExample)
JPS62145337U (enExample)
JPS6429846U (enExample)