JPS6181148U - - Google Patents
Info
- Publication number
- JPS6181148U JPS6181148U JP16521984U JP16521984U JPS6181148U JP S6181148 U JPS6181148 U JP S6181148U JP 16521984 U JP16521984 U JP 16521984U JP 16521984 U JP16521984 U JP 16521984U JP S6181148 U JPS6181148 U JP S6181148U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin material
- electrode plate
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図、第２図は従来構造図、第３図、第４図
及び第５図は本考案の実施例構造図である。
図において１は放熱板、２は半導体ペレツト、
Ｄ１〜Ｄ４はダイオードペレツト、３，４は電極
金属、５はワイヤリード線、６は樹脂材、７は絶
縁基板、８は半田、９，９′は溝である。
1 and 2 are conventional structural diagrams, and FIGS. 3, 4, and 5 are structural diagrams of embodiments of the present invention. In the figure, 1 is a heat sink, 2 is a semiconductor pellet,
D 1 to D 4 are diode pellets, 3 and 4 are electrode metals, 5 is a wire lead wire, 6 is a resin material, 7 is an insulating substrate, 8 is solder, and 9 and 9' are grooves.
Claims (1)
記放熱板と同一平面上で離間して配設した電極板
とを電気的に接続し、前記放熱板及び電極板の前
記半導体ペレツトマウント側表面を樹脂材で封止
した電力用半導体装置において前記放熱板及び電
極板間の樹脂材表面に溝を形成したことを特徴と
する電力用半導体装置。 (2) 電極板を複数個配設すると共に該電極板間
の樹脂材表面に溝を形成したことを特徴とする実
用新案登録請求の範囲第(1)項記載の電力用半導
体装置。[Claims for Utility Model Registration] (1) A semiconductor pellet mounted on a heat sink is electrically connected to an electrode plate spaced apart on the same plane as the heat sink, and the heat sink and the electrode plate are connected electrically. A power semiconductor device in which a surface of the semiconductor pellet mount side is sealed with a resin material, wherein a groove is formed in the resin material surface between the heat sink plate and the electrode plate. (2) The power semiconductor device according to claim (1) of the utility model registration, characterized in that a plurality of electrode plates are provided and grooves are formed on the surface of the resin material between the electrode plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16521984U JPS6181148U (en) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16521984U JPS6181148U (en) | 1984-10-31 | 1984-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181148U true JPS6181148U (en) | 1986-05-29 |
Family
ID=30723074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16521984U Pending JPS6181148U (en) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181148U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021141209A (en) * | 2020-03-05 | 2021-09-16 | 株式会社東芝 | Semiconductor package |
-
1984
- 1984-10-31 JP JP16521984U patent/JPS6181148U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021141209A (en) * | 2020-03-05 | 2021-09-16 | 株式会社東芝 | Semiconductor package |
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