JPS6179557U - - Google Patents

Info

Publication number
JPS6179557U
JPS6179557U JP16329484U JP16329484U JPS6179557U JP S6179557 U JPS6179557 U JP S6179557U JP 16329484 U JP16329484 U JP 16329484U JP 16329484 U JP16329484 U JP 16329484U JP S6179557 U JPS6179557 U JP S6179557U
Authority
JP
Japan
Prior art keywords
board
sub
printed wiring
receiving circuit
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16329484U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16329484U priority Critical patent/JPS6179557U/ja
Publication of JPS6179557U publication Critical patent/JPS6179557U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Filters And Equalizers (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の外観を示す斜視図
、第2図は副基板の形状を示す平面図、第3図は
日本国内仕様のB.P.Fの構成を示す回路図、
第4図はアメリカ合衆国内仕様のB.P.Fの構
成を示す回路図である。 1…(主基板上の)導体パターン、2…主基板
、3…スリツト、4…副基板、5…(副基板上の
)導体パターン、5a,5b,5c…コイルパタ
ーン、6…導体ピン、B…(コンデンサ実装用の
)孔、H…(導体ピン固定用の)孔。
Fig. 1 is a perspective view showing the appearance of one embodiment of the present invention, Fig. 2 is a plan view showing the shape of the sub-board, and Fig. 3 is a B. P. A circuit diagram showing the configuration of F,
Figure 4 shows B. P. FIG. 3 is a circuit diagram showing the configuration of F. 1... Conductor pattern (on the main board), 2... Main board, 3... Slit, 4... Sub board, 5... Conductor pattern (on the sub board), 5a, 5b, 5c... Coil pattern, 6... Conductor pin, B...hole (for capacitor mounting), H...hole (for fixing conductor pin).

Claims (1)

【実用新案登録請求の範囲】 (1) 受信回路の導体パターンが形成された主基
板と、この主基板の周縁不要部分に折り取り可能
に設けられ、かつ表面に周波数事情に応じて前記
受信回路に選択的に介挿される異なる定数値のパ
ンドパスフイルタの導体パターンが形成された複
数の副基板とからなるプリント配線基板。 (2) 各副基板の導体パターンの一部が、コイル
パターンにされている実用新案登録請求の範囲第
1項記載のプリント配線基板。
[Claims for Utility Model Registration] (1) A main board on which a conductive pattern of a receiving circuit is formed, and a part of the main board that is removably provided at an unnecessary periphery, and the receiving circuit is formed on the surface according to frequency conditions. A printed wiring board consisting of a plurality of sub-boards on which conductor patterns of breadth pass filters with different constant values are selectively inserted. (2) The printed wiring board according to claim 1, wherein a part of the conductor pattern of each sub-board is a coil pattern.
JP16329484U 1984-10-29 1984-10-29 Pending JPS6179557U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16329484U JPS6179557U (en) 1984-10-29 1984-10-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16329484U JPS6179557U (en) 1984-10-29 1984-10-29

Publications (1)

Publication Number Publication Date
JPS6179557U true JPS6179557U (en) 1986-05-27

Family

ID=30721153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16329484U Pending JPS6179557U (en) 1984-10-29 1984-10-29

Country Status (1)

Country Link
JP (1) JPS6179557U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5183830B1 (en) * 2012-04-18 2013-04-17 三菱電機株式会社 Noise filter device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5183830B1 (en) * 2012-04-18 2013-04-17 三菱電機株式会社 Noise filter device
WO2013157098A1 (en) * 2012-04-18 2013-10-24 三菱電機株式会社 Noise filter device
US8884719B2 (en) 2012-04-18 2014-11-11 Mitsubishi Electric Corporation Noise filter device

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