JPH01173958U - - Google Patents
Info
- Publication number
- JPH01173958U JPH01173958U JP7075788U JP7075788U JPH01173958U JP H01173958 U JPH01173958 U JP H01173958U JP 7075788 U JP7075788 U JP 7075788U JP 7075788 U JP7075788 U JP 7075788U JP H01173958 U JPH01173958 U JP H01173958U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic device
- device product
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は、この考案の一実施例による電子機器
製品のプリント基板のパターンの構成を示す斜視
図、第2図は第1図の平面図、第3図は第2図の
正面図である。第4図は従来の電子機器製品のプ
リント基板のパターンの構成を示す斜視図である
。
1……配線用パターン、2……プリント基板、
3……電子部品取付用スルーホール、4……パタ
ーン間接用スルーホール、5……電子部品。なお
、図中、同一符号は同一または相当部分を示す。
FIG. 1 is a perspective view showing the configuration of a pattern of a printed circuit board of an electronic device product according to an embodiment of the invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a front view of FIG. 2. . FIG. 4 is a perspective view showing the configuration of a pattern on a printed circuit board of a conventional electronic device product. 1... Wiring pattern, 2... Printed circuit board,
3...Through hole for mounting electronic components, 4...Through hole for pattern indirection, 5...Electronic components. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
リント基板上の電子部品間を接続し、回路機能を
果すための配線用パターンを備えた電子機器製品
のプリント基板において、前記配線用パターンを
上記プリント基板両面に1/2づつ分離配置し、か
つ、その分離配置したパターン間の電流を均一に
すべく複数の接続部材でパターン間を接続するよ
うにしたことを特徴とする電子機器製品のプリン
ト基板。 In a printed circuit board for an electronic device product that is provided with a wiring pattern for connecting electronic components arranged on a printed circuit board and electronic components on the printed circuit board and performing a circuit function, the wiring pattern is printed as described above. A printed circuit board for an electronic device product, characterized in that 1/2 of each pattern is separated on both sides of the board, and the patterns are connected by a plurality of connecting members to equalize the current between the separated patterns. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7075788U JPH01173958U (en) | 1988-05-27 | 1988-05-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7075788U JPH01173958U (en) | 1988-05-27 | 1988-05-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01173958U true JPH01173958U (en) | 1989-12-11 |
Family
ID=31295986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7075788U Pending JPH01173958U (en) | 1988-05-27 | 1988-05-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01173958U (en) |
-
1988
- 1988-05-27 JP JP7075788U patent/JPH01173958U/ja active Pending