JPS617640A - 実装集積回路装置の特性試験装置 - Google Patents

実装集積回路装置の特性試験装置

Info

Publication number
JPS617640A
JPS617640A JP59128920A JP12892084A JPS617640A JP S617640 A JPS617640 A JP S617640A JP 59128920 A JP59128920 A JP 59128920A JP 12892084 A JP12892084 A JP 12892084A JP S617640 A JPS617640 A JP S617640A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
pads
substrate
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59128920A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0347581B2 (enrdf_load_stackoverflow
Inventor
Yoshitaka Fukuoka
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59128920A priority Critical patent/JPS617640A/ja
Publication of JPS617640A publication Critical patent/JPS617640A/ja
Publication of JPH0347581B2 publication Critical patent/JPH0347581B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP59128920A 1984-06-22 1984-06-22 実装集積回路装置の特性試験装置 Granted JPS617640A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59128920A JPS617640A (ja) 1984-06-22 1984-06-22 実装集積回路装置の特性試験装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59128920A JPS617640A (ja) 1984-06-22 1984-06-22 実装集積回路装置の特性試験装置

Publications (2)

Publication Number Publication Date
JPS617640A true JPS617640A (ja) 1986-01-14
JPH0347581B2 JPH0347581B2 (enrdf_load_stackoverflow) 1991-07-19

Family

ID=14996641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59128920A Granted JPS617640A (ja) 1984-06-22 1984-06-22 実装集積回路装置の特性試験装置

Country Status (1)

Country Link
JP (1) JPS617640A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8757336B2 (en) 2008-12-24 2014-06-24 Kayaba Industry Co., Ltd. Damping mechanism

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5366074U (enrdf_load_stackoverflow) * 1976-10-29 1978-06-03
JPS562418A (en) * 1979-06-19 1981-01-12 Mazda Motor Corp Lubrication regulator for engine
JPS5671948A (en) * 1979-11-19 1981-06-15 Hitachi Ltd Ic chip
JPS58192333A (ja) * 1982-05-07 1983-11-09 Hitachi Ltd 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5366074U (enrdf_load_stackoverflow) * 1976-10-29 1978-06-03
JPS562418A (en) * 1979-06-19 1981-01-12 Mazda Motor Corp Lubrication regulator for engine
JPS5671948A (en) * 1979-11-19 1981-06-15 Hitachi Ltd Ic chip
JPS58192333A (ja) * 1982-05-07 1983-11-09 Hitachi Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8757336B2 (en) 2008-12-24 2014-06-24 Kayaba Industry Co., Ltd. Damping mechanism

Also Published As

Publication number Publication date
JPH0347581B2 (enrdf_load_stackoverflow) 1991-07-19

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term