JPS5671948A - Ic chip - Google Patents

Ic chip

Info

Publication number
JPS5671948A
JPS5671948A JP14889579A JP14889579A JPS5671948A JP S5671948 A JPS5671948 A JP S5671948A JP 14889579 A JP14889579 A JP 14889579A JP 14889579 A JP14889579 A JP 14889579A JP S5671948 A JPS5671948 A JP S5671948A
Authority
JP
Japan
Prior art keywords
check
electrodes
electrode
dummy
bump electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14889579A
Other languages
Japanese (ja)
Inventor
Minoru Honda
Akira Nagai
Kiyobumi Uchibori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14889579A priority Critical patent/JPS5671948A/en
Publication of JPS5671948A publication Critical patent/JPS5671948A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To ensure accurate size measuring by keeping upon the check of electric characteristic one or two dummy bump electrodes provided in addition to bump electrodes for the check faultless when the electrodes are shaped semispherical or into a table form on an IC chip using solder. CONSTITUTION:A plurality of semispherical or table-shaped solder bump electrodes 2 are provided on the both sides of an IC chip body 1 to check electric characteristic. Besides, one dummy solder bump electrode 3 or two dummy solder bump electrodes 4 are provided which are not used for check. The electrode 2 is used to check electrode characteristic but the electrodes 3 or 4 are left not used for check. Thereby, even if the electrode is deformed upon the contact of a probe, the electrodes 3 or 4 are kept faultless so that size measuring can be made accurately.
JP14889579A 1979-11-19 1979-11-19 Ic chip Pending JPS5671948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14889579A JPS5671948A (en) 1979-11-19 1979-11-19 Ic chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14889579A JPS5671948A (en) 1979-11-19 1979-11-19 Ic chip

Publications (1)

Publication Number Publication Date
JPS5671948A true JPS5671948A (en) 1981-06-15

Family

ID=15463083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14889579A Pending JPS5671948A (en) 1979-11-19 1979-11-19 Ic chip

Country Status (1)

Country Link
JP (1) JPS5671948A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617640A (en) * 1984-06-22 1986-01-14 Toshiba Corp Method and apparatus for testing characteristic of integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617640A (en) * 1984-06-22 1986-01-14 Toshiba Corp Method and apparatus for testing characteristic of integrated circuit device
JPH0347581B2 (en) * 1984-06-22 1991-07-19 Tokyo Shibaura Electric Co

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