JPS562647A - Probe-card - Google Patents

Probe-card

Info

Publication number
JPS562647A
JPS562647A JP7848879A JP7848879A JPS562647A JP S562647 A JPS562647 A JP S562647A JP 7848879 A JP7848879 A JP 7848879A JP 7848879 A JP7848879 A JP 7848879A JP S562647 A JPS562647 A JP S562647A
Authority
JP
Japan
Prior art keywords
probe
card
probes
chip
spaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7848879A
Other languages
Japanese (ja)
Inventor
Kimio Meguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7848879A priority Critical patent/JPS562647A/en
Publication of JPS562647A publication Critical patent/JPS562647A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To attempt the reduction of spaces between electrodes of a semiconductor chip to be measured to reduce the chip area by a method wherein the part of a probe-card except the probe-tips are insulated. CONSTITUTION:Probes 3 previously covered with an insulator 8 are fixed in the positions in accordance with that of electrodes 7 of a chip 6 to be measured. When this probe-card is used, as each probe is completely insulated except tip, the short- circuiting between the neighboring probes does not take place although the card is used consecutively for a long time. Therefore the spaces between the probes can be reduced to reduce the tip area.
JP7848879A 1979-06-21 1979-06-21 Probe-card Pending JPS562647A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7848879A JPS562647A (en) 1979-06-21 1979-06-21 Probe-card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7848879A JPS562647A (en) 1979-06-21 1979-06-21 Probe-card

Publications (1)

Publication Number Publication Date
JPS562647A true JPS562647A (en) 1981-01-12

Family

ID=13663355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7848879A Pending JPS562647A (en) 1979-06-21 1979-06-21 Probe-card

Country Status (1)

Country Link
JP (1) JPS562647A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63172970A (en) * 1987-01-12 1988-07-16 Matsushita Electric Ind Co Ltd Measuring probe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63172970A (en) * 1987-01-12 1988-07-16 Matsushita Electric Ind Co Ltd Measuring probe

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