JPS6175525A - 微細加工方法 - Google Patents

微細加工方法

Info

Publication number
JPS6175525A
JPS6175525A JP59192970A JP19297084A JPS6175525A JP S6175525 A JPS6175525 A JP S6175525A JP 59192970 A JP59192970 A JP 59192970A JP 19297084 A JP19297084 A JP 19297084A JP S6175525 A JPS6175525 A JP S6175525A
Authority
JP
Japan
Prior art keywords
film
etched
etching
resist
organic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59192970A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546096B2 (OSRAM
Inventor
Kyusaku Nishioka
西岡　久作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59192970A priority Critical patent/JPS6175525A/ja
Publication of JPS6175525A publication Critical patent/JPS6175525A/ja
Publication of JPH0546096B2 publication Critical patent/JPH0546096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/00—

Landscapes

  • Drying Of Semiconductors (AREA)
JP59192970A 1984-09-12 1984-09-12 微細加工方法 Granted JPS6175525A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59192970A JPS6175525A (ja) 1984-09-12 1984-09-12 微細加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59192970A JPS6175525A (ja) 1984-09-12 1984-09-12 微細加工方法

Publications (2)

Publication Number Publication Date
JPS6175525A true JPS6175525A (ja) 1986-04-17
JPH0546096B2 JPH0546096B2 (OSRAM) 1993-07-13

Family

ID=16300071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59192970A Granted JPS6175525A (ja) 1984-09-12 1984-09-12 微細加工方法

Country Status (1)

Country Link
JP (1) JPS6175525A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013183A (ja) * 2004-06-28 2006-01-12 Opnext Japan Inc 半導体光素子とその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546570A (en) * 1977-06-16 1979-01-18 Sumitomo Electric Ind Ltd Production of optical guides

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546570A (en) * 1977-06-16 1979-01-18 Sumitomo Electric Ind Ltd Production of optical guides

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013183A (ja) * 2004-06-28 2006-01-12 Opnext Japan Inc 半導体光素子とその製造方法

Also Published As

Publication number Publication date
JPH0546096B2 (OSRAM) 1993-07-13

Similar Documents

Publication Publication Date Title
JPH0471222A (ja) パターン形成方法
JPH02266517A (ja) 半導体装置の製造方法
JPS61273546A (ja) 金属シリサイドフオトマスクの製造方法
JPS6175525A (ja) 微細加工方法
JPH0458167B2 (OSRAM)
JPH06244156A (ja) パタ―ン形成法
JPS6354726A (ja) レジスト膜のエツチング方法
JPH01105538A (ja) フォトレジストパターン形成方法
JPS61288426A (ja) アルミニウム膜のテ−パエツチング方法
JPS5950053B2 (ja) 写真蝕刻方法
JPS61123144A (ja) 微細加工方法
JPS6057630A (ja) 半導体装置の製造方法
JPS62234333A (ja) 微細溝加工用マスクの形成方法
JPS5892224A (ja) パタ−ン形成方法
JPH0282527A (ja) 半導体装置の製造方法
JPS63226930A (ja) 半導体装置の製造方法
JPH0263049A (ja) マスクパターンを有する基板及びその製造方法
JPS60207339A (ja) パタ−ン形成方法
JPH04364726A (ja) パターン形成方法
JPH01214026A (ja) メサ構造のエッチング方法
JPH04335644A (ja) パターン形成方法
JPH07111964B2 (ja) 微細パターンの形成方法
JPH0289315A (ja) 半導体装置の製造方法
JPS59172727A (ja) 微細幅の厚膜パタ−ンの形成方法
JPH0353522A (ja) 垂直壁面のエッチング方法