JPS6167578U - - Google Patents
Info
- Publication number
- JPS6167578U JPS6167578U JP15229484U JP15229484U JPS6167578U JP S6167578 U JPS6167578 U JP S6167578U JP 15229484 U JP15229484 U JP 15229484U JP 15229484 U JP15229484 U JP 15229484U JP S6167578 U JPS6167578 U JP S6167578U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor integrated
- integrated circuit
- conduction
- heat dissipation
- testing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図はこの考案の一実施例を示す概略断面図
、第２図は従来の半導体集積回路の通電テスト装
置を示す概略断面図である。
３…半導体集積回路、５…ラバー（弾性体）、
７…放熱用フイン。なお、各図中、同一符号は同
一又は相当部分を示す。
FIG. 1 is a schematic sectional view showing an embodiment of this invention, and FIG. 2 is a schematic sectional view showing a conventional conduction test device for semiconductor integrated circuits. 3...Semiconductor integrated circuit, 5...Rubber (elastic body),
7... Fin for heat radiation. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
放出する放熱手段を備えた半導体集積回路の通電
テスト装置において、半導体集積回路の表面に載
置され、放熱用フインが表面に設けられている熱
良導性・絶縁性のものよりなる弾性体を備えてな
ることを特徴とする半導体集積回路の通電テスト
装置。 In a semiconductor integrated circuit conduction testing device that is equipped with a heat dissipation means for dissipating heat generated during a conduction test of a semiconductor integrated circuit, the thermal conductivity test device is placed on the surface of the semiconductor integrated circuit and has heat dissipation fins on the surface. 1. A conduction testing device for semiconductor integrated circuits, characterized in that the device comprises an elastic body made of a material having properties and insulating properties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15229484U JPS6167578U (en) | 1984-10-11 | 1984-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15229484U JPS6167578U (en) | 1984-10-11 | 1984-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6167578U true JPS6167578U (en) | 1986-05-09 |
Family
ID=30710363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15229484U Pending JPS6167578U (en) | 1984-10-11 | 1984-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6167578U (en) |
-
1984
- 1984-10-11 JP JP15229484U patent/JPS6167578U/ja active Pending
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