JPS6252992U - - Google Patents

Info

Publication number
JPS6252992U
JPS6252992U JP1985145282U JP14528285U JPS6252992U JP S6252992 U JPS6252992 U JP S6252992U JP 1985145282 U JP1985145282 U JP 1985145282U JP 14528285 U JP14528285 U JP 14528285U JP S6252992 U JPS6252992 U JP S6252992U
Authority
JP
Japan
Prior art keywords
diode
field effect
effect transistor
inverter device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985145282U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985145282U priority Critical patent/JPS6252992U/ja
Publication of JPS6252992U publication Critical patent/JPS6252992U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electronic Switches (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る実施例を示す側断面図、
第２図は第１図の―線矢示方向断面図、第３
図は回路構成図、第４図乃至第７図は従来技術を
示し、第４図は外観図、第５図は回路構成図、第
６図は平面図、第７図は側面図である。 ２，３……ＭＯＳＦＥＴ（電界効果トランジス
タ）、４，５，６，７……ダイオード、１３……
放熱器（放熱手段）、２１……銅ベース板（基板
）。 FIG. 1 is a side sectional view showing an embodiment of the present invention;
Figure 2 is a sectional view in the direction of the - line arrow in Figure 1;
The figure is a circuit configuration diagram, FIGS. 4 to 7 show the prior art, FIG. 4 is an external view, FIG. 5 is a circuit configuration diagram, FIG. 6 is a plan view, and FIG. 7 is a side view. 2, 3...MOSFET (field effect transistor), 4, 5, 6, 7...diode, 13...
Heat radiator (heat radiating means), 21... copper base plate (substrate).

Claims (1)

【実用新案登録請求の範囲】 電界効果トランジスタとダイオードとから構成
されたインバータ装置において、 上記電界効果トランジスタとダイオードを同一
基板上に設置し、且つ該基板に接触させて放熱手
段を設けたことを特徴とするインバータ装置。[Claims for Utility Model Registration] In an inverter device composed of a field effect transistor and a diode, the field effect transistor and the diode are installed on the same substrate, and a heat dissipation means is provided in contact with the substrate. Features of the inverter device.
JP1985145282U 1985-09-24 1985-09-24 Pending JPS6252992U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985145282U JPS6252992U (en) 1985-09-24 1985-09-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985145282U JPS6252992U (en) 1985-09-24 1985-09-24

Publications (1)

Publication Number Publication Date
JPS6252992U true JPS6252992U (en) 1987-04-02

Family

ID=31056677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985145282U Pending JPS6252992U (en) 1985-09-24 1985-09-24

Country Status (1)

Country Link
JP (1) JPS6252992U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290098A (en) * 1989-02-10 1990-11-29 Fuji Electric Co Ltd Cooling device for inverter apparatus
WO2013136623A1 (en) * 2012-03-13 2013-09-19 富士電機株式会社 Power converter and apparatus for controlling same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761985B2 (en) * 1975-10-11 1982-12-27 Mitsubishi Electric Corp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761985B2 (en) * 1975-10-11 1982-12-27 Mitsubishi Electric Corp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290098A (en) * 1989-02-10 1990-11-29 Fuji Electric Co Ltd Cooling device for inverter apparatus
WO2013136623A1 (en) * 2012-03-13 2013-09-19 富士電機株式会社 Power converter and apparatus for controlling same

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