JPS6165757U - - Google Patents
Info
- Publication number
- JPS6165757U JPS6165757U JP15024984U JP15024984U JPS6165757U JP S6165757 U JPS6165757 U JP S6165757U JP 15024984 U JP15024984 U JP 15024984U JP 15024984 U JP15024984 U JP 15024984U JP S6165757 U JPS6165757 U JP S6165757U
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- coating layer
- alloy
- copper
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000011247 coating layer Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案によるリードフレームを用いた
パツケージの一例の断面図である。第２図はリー
ドフレーム平面図例で、第３図はレジンモールド
ＤＩＰ型半導体の断面図例である。 １：リードフレームのタブ部、２：インナーリ
ード部、３：Ｓｉチツプ、４：接着剤又はろう、
５：金属細線、６：電極パツド、７：樹脂、８：
アウターリード部、９：リードフレーム基材、１
０：Ｎｉ材被覆層、１１：Ｐｄ材薄層。
パツケージの一例の断面図である。第２図はリー
ドフレーム平面図例で、第３図はレジンモールド
ＤＩＰ型半導体の断面図例である。 １：リードフレームのタブ部、２：インナーリ
ード部、３：Ｓｉチツプ、４：接着剤又はろう、
５：金属細線、６：電極パツド、７：樹脂、８：
アウターリード部、９：リードフレーム基材、１
０：Ｎｉ材被覆層、１１：Ｐｄ材薄層。
Claims (1)
- 半導体パツケージに使用されるリードフレーム
において、銅又は銅合金からなる基材の表面に、
Ｎｉ又はＣｏ或いはこれらの合金からなる厚さ０
．０５μ以上の被覆層が設けられ、少なくもワイ
ヤボンドされるインナーリーリード部には上記被
覆層の上に更にＰｄ又はＲｕ或いはこれらの合金
からなる厚さ０．０１〜０．２μの薄層が設けら
れていることを特徴とする半導体リードフレーム
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15024984U JPS6165757U (ja) | 1984-10-05 | 1984-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15024984U JPS6165757U (ja) | 1984-10-05 | 1984-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6165757U true JPS6165757U (ja) | 1986-05-06 |
Family
ID=30708402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15024984U Pending JPS6165757U (ja) | 1984-10-05 | 1984-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6165757U (ja) |
-
1984
- 1984-10-05 JP JP15024984U patent/JPS6165757U/ja active Pending