JPS6169842U - - Google Patents

Info

Publication number
JPS6169842U
JPS6169842U JP15364584U JP15364584U JPS6169842U JP S6169842 U JPS6169842 U JP S6169842U JP 15364584 U JP15364584 U JP 15364584U JP 15364584 U JP15364584 U JP 15364584U JP S6169842 U JPS6169842 U JP S6169842U
Authority
JP
Japan
Prior art keywords
lead frame
coating layer
alloy
semiconductor
frame according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15364584U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15364584U priority Critical patent/JPS6169842U/ja
Publication of JPS6169842U publication Critical patent/JPS6169842U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図ａはＣｕ合金条の片面の全面に亘つてＮ
ｉ材被覆層とＺｎ材表層とを設けた本考案による
リードフレームの縦、横の断面を示した拡大斜視
図。第１図ｂはＣｕ合金条の両面の全面にＮｉ材
被覆層を設け、その片面の全面にＺｎ表層を設け
た本考案によるリードフレームの縦横の断面を示
した拡大斜視図。第１図ｃはＣｕ合金条の両面の
全面にＮｉ材被覆層とＺｎ材表面を設けた、本考
案によるリードフレームの縦、横の断面を示した
拡大斜視図である。第１図ｄは、本考案によるリ
ードフレームを用いた半導体ＤＩＰ型パツケージ
の断面図である。第２図はリードフレームの平面
図で第３図はリードフレームの断面図である。 １：タブ部、２：素子（チツプ）、３：接着層
、４：電極パツド、５：インナリード部、６：ワ
イヤボンデイング細線、７：樹脂、８：タイバー
、９：アウターリード部、１０：リードフレーム
基体、１１：Ｎｉ材被覆層、１２：Ｚｎ材表層。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) Ｃｕ又はＣｕ合金の板又は条より成型され
    たリードフレームにおいて、リードフレーム基体
    上に、Ｎｉ又はＮｉ合金の被覆層を有し、該被覆
    層の上方に、Ｚｎ又はＺｎ合金の表層を有するこ
    とを特徴とする半導体フリードフレーム。 (2) 上記の被覆層は、その厚さは０．１〜５μ
    である実用新案登録請求の範囲第１項記載の半導
    体リードフレーム。 (3) 上記の表層は少なくともインナーリード端
    部に施されている実用新案登録請求の範囲第１項
    記載の半導体リードフレーム。
JP15364584U 1984-10-13 1984-10-13 Pending JPS6169842U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15364584U JPS6169842U (ja) 1984-10-13 1984-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15364584U JPS6169842U (ja) 1984-10-13 1984-10-13

Publications (1)

Publication Number Publication Date
JPS6169842U true JPS6169842U (ja) 1986-05-13

Family

ID=30711655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15364584U Pending JPS6169842U (ja) 1984-10-13 1984-10-13

Country Status (1)

Country Link
JP (1) JPS6169842U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021120991A (ja) * 2020-01-30 2021-08-19 大口マテリアル株式会社 リードフレーム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021120991A (ja) * 2020-01-30 2021-08-19 大口マテリアル株式会社 リードフレーム

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