JPS61136554U - - Google Patents
Info
- Publication number
- JPS61136554U JPS61136554U JP1993285U JP1993285U JPS61136554U JP S61136554 U JPS61136554 U JP S61136554U JP 1993285 U JP1993285 U JP 1993285U JP 1993285 U JP1993285 U JP 1993285U JP S61136554 U JPS61136554 U JP S61136554U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- inner lead
- resin
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームを使用して製
造された樹脂封止型半導体装置の断面図、第２図
及び第３図は従来のリードフレームを使用して製
造された樹脂封止型半導体装置の断面図である。 １……ダイマウント部、２……半導体素子、３
……金属細線、４……金めつき膜、５……インナ
ーリード、５ａ……インナーリード先端部、６…
…アウターリード、７……封止樹脂。
造された樹脂封止型半導体装置の断面図、第２図
及び第３図は従来のリードフレームを使用して製
造された樹脂封止型半導体装置の断面図である。 １……ダイマウント部、２……半導体素子、３
……金属細線、４……金めつき膜、５……インナ
ーリード、５ａ……インナーリード先端部、６…
…アウターリード、７……封止樹脂。
Claims (1)
- 樹脂封止型半導体装置用リードフレームにおい
て、インナーリード先端部のワイヤーボンデイン
グ面がダイマウント部の半導体素子載置面より上
方に位置するようにインナーリードが折り曲げら
れていることを特徴とする半導体装置用リードフ
レーム。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993285U JPS61136554U (ja) | 1985-02-14 | 1985-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993285U JPS61136554U (ja) | 1985-02-14 | 1985-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61136554U true JPS61136554U (ja) | 1986-08-25 |
Family
ID=30509958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1993285U Pending JPS61136554U (ja) | 1985-02-14 | 1985-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61136554U (ja) |
-
1985
- 1985-02-14 JP JP1993285U patent/JPS61136554U/ja active Pending