JPH02146449U - - Google Patents

Info

Publication number
JPH02146449U
JPH02146449U JP1989056577U JP5657789U JPH02146449U JP H02146449 U JPH02146449 U JP H02146449U JP 1989056577 U JP1989056577 U JP 1989056577U JP 5657789 U JP5657789 U JP 5657789U JP H02146449 U JPH02146449 U JP H02146449U
Authority
JP
Japan
Prior art keywords
heat sink
resin
semiconductor device
sealed semiconductor
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989056577U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989056577U priority Critical patent/JPH02146449U/ja
Publication of JPH02146449U publication Critical patent/JPH02146449U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

【図面の簡単な説明】
第１図は本考案に係る樹脂封止型半導体装置の
一部断面斜視図、第２図は同じく製造途中におけ
る断面図、第３図は変形例を示す樹脂封止型半導
体装置の一部断面斜視図、第４図はさらに異なる
樹脂封止型半導体装置の製造途中における断面図
である。第５図は従来の樹脂封止型半導体装置の
一部断面斜視図、第６図は同じく製造途中におけ
る断面図である。 ２……リード、３……半導体ペレツト、４……
金属細線、５……樹脂、１１，１２……放熱板、
１１ｃ，１２ｃ……上面、１１ｄ，１１ｄ……下
面、１１ｅ，１２ｅ……中間部位、１１ｆ……切
欠き部、１２ｆ……貫通孔、５０……溶融樹脂。

Claims (1)

  1. 【実用新案登録請求の範囲】 放熱板上に固着された半導体ペレツトと、上記
    放熱板の近傍に延びるリードとを金属細線にて電
    気的に接続し、半導体ペレツト及び放熱板の上下
    面を含む主要部を、樹脂にて被覆した樹脂封止半
    導体装置において、 樹脂を被覆する際の上記放熱板上を流動する溶
    融樹脂進行方向に一致して傾斜する切欠き部又は
    貫通孔を、上記放熱板の中間部位に形成したこと
    を特徴とする樹脂封止型半導体装置。
JP1989056577U 1989-05-16 1989-05-16 Pending JPH02146449U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989056577U JPH02146449U (ja) 1989-05-16 1989-05-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989056577U JPH02146449U (ja) 1989-05-16 1989-05-16

Publications (1)

Publication Number Publication Date
JPH02146449U true JPH02146449U (ja) 1990-12-12

Family

ID=31580530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989056577U Pending JPH02146449U (ja) 1989-05-16 1989-05-16

Country Status (1)

Country Link
JP (1) JPH02146449U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162550A (ja) * 1990-10-26 1992-06-08 Nec Corp 樹脂封止型半導体装置およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6322747B2 (ja) * 1982-06-24 1988-05-13 Fujitsu Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6322747B2 (ja) * 1982-06-24 1988-05-13 Fujitsu Ltd

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162550A (ja) * 1990-10-26 1992-06-08 Nec Corp 樹脂封止型半導体装置およびその製造方法

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