JPS6161533B2 - - Google Patents

Info

Publication number
JPS6161533B2
JPS6161533B2 JP55005817A JP581780A JPS6161533B2 JP S6161533 B2 JPS6161533 B2 JP S6161533B2 JP 55005817 A JP55005817 A JP 55005817A JP 581780 A JP581780 A JP 581780A JP S6161533 B2 JPS6161533 B2 JP S6161533B2
Authority
JP
Japan
Prior art keywords
glass
semiconductor wafer
slurry
film
organic substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55005817A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56104443A (en
Inventor
Masaaki Takahashi
Yutaka Misawa
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP581780A priority Critical patent/JPS56104443A/ja
Publication of JPS56104443A publication Critical patent/JPS56104443A/ja
Publication of JPS6161533B2 publication Critical patent/JPS6161533B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3178Coating or filling in grooves made in the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP581780A 1980-01-23 1980-01-23 Manufacture of semiconductor device Granted JPS56104443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP581780A JPS56104443A (en) 1980-01-23 1980-01-23 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP581780A JPS56104443A (en) 1980-01-23 1980-01-23 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56104443A JPS56104443A (en) 1981-08-20
JPS6161533B2 true JPS6161533B2 (enrdf_load_stackoverflow) 1986-12-26

Family

ID=11621629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP581780A Granted JPS56104443A (en) 1980-01-23 1980-01-23 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56104443A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61164045U (enrdf_load_stackoverflow) * 1986-03-20 1986-10-11
US5448111A (en) * 1993-09-20 1995-09-05 Fujitsu Limited Semiconductor device and method for fabricating the same
JP2010514958A (ja) 2006-12-21 2010-05-06 ジョンソンディバーシー・インコーポレーテッド 床仕上げ剤塗布アセンブリおよび方法
CN103403846B (zh) * 2012-01-31 2016-07-06 新电元工业株式会社 半导体接合保护用玻璃复合物、半导体装置的制造方法及半导体装置
US9318401B2 (en) * 2012-05-08 2016-04-19 Shindengen Electric Manufacturing Co., Ltd. Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS491611A (enrdf_load_stackoverflow) * 1972-04-19 1974-01-09
JPS5128813A (ja) * 1974-09-04 1976-03-11 Hitachi Ltd Handotaisochihifukuyogarasu no seizohoho

Also Published As

Publication number Publication date
JPS56104443A (en) 1981-08-20

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