JPS6159000B2 - - Google Patents

Info

Publication number
JPS6159000B2
JPS6159000B2 JP55140614A JP14061480A JPS6159000B2 JP S6159000 B2 JPS6159000 B2 JP S6159000B2 JP 55140614 A JP55140614 A JP 55140614A JP 14061480 A JP14061480 A JP 14061480A JP S6159000 B2 JPS6159000 B2 JP S6159000B2
Authority
JP
Japan
Prior art keywords
wiring board
board device
circuit elements
circuit element
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55140614A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5764990A (en
Inventor
Masaru Sakaguchi
Ichiro Ishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14061480A priority Critical patent/JPS5764990A/ja
Publication of JPS5764990A publication Critical patent/JPS5764990A/ja
Publication of JPS6159000B2 publication Critical patent/JPS6159000B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP14061480A 1980-10-09 1980-10-09 Method of exchanging circuit element in wired substrate unit Granted JPS5764990A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14061480A JPS5764990A (en) 1980-10-09 1980-10-09 Method of exchanging circuit element in wired substrate unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14061480A JPS5764990A (en) 1980-10-09 1980-10-09 Method of exchanging circuit element in wired substrate unit

Publications (2)

Publication Number Publication Date
JPS5764990A JPS5764990A (en) 1982-04-20
JPS6159000B2 true JPS6159000B2 (enrdf_load_stackoverflow) 1986-12-13

Family

ID=15272796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14061480A Granted JPS5764990A (en) 1980-10-09 1980-10-09 Method of exchanging circuit element in wired substrate unit

Country Status (1)

Country Link
JP (1) JPS5764990A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH026199U (enrdf_load_stackoverflow) * 1988-06-25 1990-01-16

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944900A (ja) * 1982-09-08 1984-03-13 松下電器産業株式会社 配線基板装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5147219B2 (enrdf_load_stackoverflow) * 1972-06-16 1976-12-14
JPS54116670A (en) * 1978-03-03 1979-09-11 Nippon Telegraph & Telephone Flexible sheet for electric connection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH026199U (enrdf_load_stackoverflow) * 1988-06-25 1990-01-16

Also Published As

Publication number Publication date
JPS5764990A (en) 1982-04-20

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