JPS6158542B2 - - Google Patents
Info
- Publication number
- JPS6158542B2 JPS6158542B2 JP8829378A JP8829378A JPS6158542B2 JP S6158542 B2 JPS6158542 B2 JP S6158542B2 JP 8829378 A JP8829378 A JP 8829378A JP 8829378 A JP8829378 A JP 8829378A JP S6158542 B2 JPS6158542 B2 JP S6158542B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- silver
- weight
- heat treatment
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 28
- 229910052709 silver Inorganic materials 0.000 claims description 24
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 239000004332 silver Substances 0.000 claims description 22
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- 230000007797 corrosion Effects 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000005476 soldering Methods 0.000 description 9
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8829378A JPS5518505A (en) | 1978-07-21 | 1978-07-21 | Soldering alloy for attaching silver electrode leading wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8829378A JPS5518505A (en) | 1978-07-21 | 1978-07-21 | Soldering alloy for attaching silver electrode leading wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5518505A JPS5518505A (en) | 1980-02-08 |
| JPS6158542B2 true JPS6158542B2 (enrdf_load_stackoverflow) | 1986-12-12 |
Family
ID=13938855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8829378A Granted JPS5518505A (en) | 1978-07-21 | 1978-07-21 | Soldering alloy for attaching silver electrode leading wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5518505A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10818861B2 (en) | 2012-04-13 | 2020-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element, light-emitting device, electronic device, and lighting device |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59153857A (ja) * | 1983-02-21 | 1984-09-01 | Taruchin Kk | 接合部形成用合金 |
| JPS59216628A (ja) * | 1983-05-23 | 1984-12-06 | Kao Corp | 二重乳化油脂組成物 |
| GB2201545B (en) * | 1987-01-30 | 1991-09-11 | Tanaka Electronics Ind | Method for connecting semiconductor material |
| JP2543941B2 (ja) * | 1988-03-17 | 1996-10-16 | 大豊工業株式会社 | はんだ材 |
| US5019457A (en) * | 1988-10-13 | 1991-05-28 | Sumitomo Electric Industries, Ltd. | Conductor used as a fuse |
| EP0652072A1 (en) * | 1993-11-09 | 1995-05-10 | Matsushita Electric Industrial Co., Ltd. | Solder |
| JP3160583B2 (ja) | 1999-01-27 | 2001-04-25 | 日本特殊陶業株式会社 | 樹脂製基板 |
| CN104741819B (zh) * | 2013-12-31 | 2018-11-16 | 北京有色金属与稀土应用研究所 | 一种Pb-Sn-Sb-Ag合金钎料及其制备方法 |
| CN109923225B (zh) * | 2016-09-27 | 2021-08-10 | 梅塔洛比利时公司 | 改进型焊料及用于生产高纯铅的方法 |
-
1978
- 1978-07-21 JP JP8829378A patent/JPS5518505A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10818861B2 (en) | 2012-04-13 | 2020-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element, light-emitting device, electronic device, and lighting device |
| US11393997B2 (en) | 2012-04-13 | 2022-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element, light-emitting device, electronic device, and lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5518505A (en) | 1980-02-08 |
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