JPS5518505A - Soldering alloy for attaching silver electrode leading wire - Google Patents
Soldering alloy for attaching silver electrode leading wireInfo
- Publication number
- JPS5518505A JPS5518505A JP8829378A JP8829378A JPS5518505A JP S5518505 A JPS5518505 A JP S5518505A JP 8829378 A JP8829378 A JP 8829378A JP 8829378 A JP8829378 A JP 8829378A JP S5518505 A JPS5518505 A JP S5518505A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- soldering alloy
- leading wire
- silver electrode
- electrode leading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title abstract 5
- 229910045601 alloy Inorganic materials 0.000 title abstract 3
- 239000000956 alloy Substances 0.000 title abstract 3
- 229910052709 silver Inorganic materials 0.000 title abstract 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title abstract 2
- 239000004332 silver Substances 0.000 title abstract 2
- 239000000919 ceramic Substances 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 238000004534 enameling Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000003973 paint Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Landscapes
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8829378A JPS5518505A (en) | 1978-07-21 | 1978-07-21 | Soldering alloy for attaching silver electrode leading wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8829378A JPS5518505A (en) | 1978-07-21 | 1978-07-21 | Soldering alloy for attaching silver electrode leading wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5518505A true JPS5518505A (en) | 1980-02-08 |
| JPS6158542B2 JPS6158542B2 (enrdf_load_stackoverflow) | 1986-12-12 |
Family
ID=13938855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8829378A Granted JPS5518505A (en) | 1978-07-21 | 1978-07-21 | Soldering alloy for attaching silver electrode leading wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5518505A (enrdf_load_stackoverflow) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59153857A (ja) * | 1983-02-21 | 1984-09-01 | Taruchin Kk | 接合部形成用合金 |
| JPS59216628A (ja) * | 1983-05-23 | 1984-12-06 | Kao Corp | 二重乳化油脂組成物 |
| US4869871A (en) * | 1988-03-17 | 1989-09-26 | Toyota Motor Corporation | Pb-Sn-Sb-In solder alloy |
| US5019457A (en) * | 1988-10-13 | 1991-05-28 | Sumitomo Electric Industries, Ltd. | Conductor used as a fuse |
| US5384090A (en) * | 1987-01-30 | 1995-01-24 | Tanaka Denshi Kogyo Kabushiki Kaisha | Fine wire for forming bump electrodes using a wire bonder |
| EP0652072A1 (en) * | 1993-11-09 | 1995-05-10 | Matsushita Electric Industrial Co., Ltd. | Solder |
| US6518518B1 (en) | 1999-01-27 | 2003-02-11 | Ngk Spark Plug Co., Ltd. | Resin substrate |
| CN104741819A (zh) * | 2013-12-31 | 2015-07-01 | 北京有色金属与稀土应用研究所 | 一种Pb-Sn-Sb-Ag合金钎料及其制备方法 |
| CN109923225A (zh) * | 2016-09-27 | 2019-06-21 | 梅塔洛比利时公司 | 改进型焊料及用于生产高纯铅的方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6158542B2 (ja) | 2012-04-13 | 2017-07-05 | 株式会社半導体エネルギー研究所 | 発光素子、発光装置、電子機器、および照明装置 |
-
1978
- 1978-07-21 JP JP8829378A patent/JPS5518505A/ja active Granted
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59153857A (ja) * | 1983-02-21 | 1984-09-01 | Taruchin Kk | 接合部形成用合金 |
| JPS59216628A (ja) * | 1983-05-23 | 1984-12-06 | Kao Corp | 二重乳化油脂組成物 |
| US5514912A (en) * | 1987-01-30 | 1996-05-07 | Tanaka Denshi Kogyo Kabushiki Kaisha | Method for connecting semiconductor material and semiconductor device used in connecting method |
| US5384090A (en) * | 1987-01-30 | 1995-01-24 | Tanaka Denshi Kogyo Kabushiki Kaisha | Fine wire for forming bump electrodes using a wire bonder |
| US5514334A (en) * | 1987-01-30 | 1996-05-07 | Tanaka Denshi Kogyo Kabushiki Kaisha | Fine lead alloy wire for forming bump electrodes |
| US4869871A (en) * | 1988-03-17 | 1989-09-26 | Toyota Motor Corporation | Pb-Sn-Sb-In solder alloy |
| US5019457A (en) * | 1988-10-13 | 1991-05-28 | Sumitomo Electric Industries, Ltd. | Conductor used as a fuse |
| EP0652072A1 (en) * | 1993-11-09 | 1995-05-10 | Matsushita Electric Industrial Co., Ltd. | Solder |
| US6518518B1 (en) | 1999-01-27 | 2003-02-11 | Ngk Spark Plug Co., Ltd. | Resin substrate |
| US7291791B2 (en) | 1999-01-27 | 2007-11-06 | Ngk Spark Plug Co., Ltd. | Resin substrate |
| CN104741819A (zh) * | 2013-12-31 | 2015-07-01 | 北京有色金属与稀土应用研究所 | 一种Pb-Sn-Sb-Ag合金钎料及其制备方法 |
| CN109923225A (zh) * | 2016-09-27 | 2019-06-21 | 梅塔洛比利时公司 | 改进型焊料及用于生产高纯铅的方法 |
| CN109923225B (zh) * | 2016-09-27 | 2021-08-10 | 梅塔洛比利时公司 | 改进型焊料及用于生产高纯铅的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6158542B2 (enrdf_load_stackoverflow) | 1986-12-12 |
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